异构集成的最新进展和趋势

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2019-06-27 DOI:10.4071/IMAPS.780287

J. Lau

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引用次数: 18

摘要

本文介绍了异构集成技术的最新进展和发展趋势。重点放在:(A)异质集成的定义，(B)异质集成的分类，例如(A)有机基板上的异质集成，(B)硅基板上的异质集成，(c)硅基板上的异质集成，(d)扇出RDL(再分布层)基板，(e)陶瓷基板上的异质集成，以及(c)芯片到芯片，芯片到晶圆，存储堆栈，封装对封装，发光二极管，CMOS图像传感器的异质集成示例，微机电系统，垂直腔面发射激光器，光电探测器。并对异构集成的发展趋势进行了展望。

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Recent Advances and Trends in Heterogeneous Integrations

The recent advances and trends in heterogeneous integrations are presented in this study. Emphasis is placed on: (A) the definition of heterogeneous integrations, (B) the classifications of heterogeneous integrations such as heterogeneous integrations on (a) organic substrates, (b) silicon substrates (through-silicon via interposers), (c) silicon substrates (bridges), (d) fan-out RDL (redistribution-layer) substrates, and (e) ceramic substrates, and (C) the examples of heterogeneous integrations of chip-to-chip, chip-to-wafer, memory stacks, package-on-package, light-emitting diode, CMOS image sensors, microelectro-mechanical systems, vertical-cavity surface-emitting laser, and photodetector. The trends of heterogeneous integrations are also presented.

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.