S. Thekkut, R. Sivasubramony, A. Raj, Yuki Kawana, Jones Assiedu, K. Mirpuri, N. Shahane, P. Thompson, P. Borgesen
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Effective Constitutive Relations for Sintered Nano Copper Joints
Sintered copper nano particles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains vs. time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e. unlike for solder general constitutive relations are not possible. The present work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.