多重分布层大芯片的扇出晶圆级封装(FOWLP)

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2017-12-20 DOI:10.4071/IMAPS.522798

J. Lau, Ming Li, N. Fan, E. Kuah, Zhang Li, K. Tan, Tony Chen, Iris Xu, Margie Li, Y. Cheung, Wu Kai, J. Hao, R. Beica, Thomas Taylor, C. Ko, Henry Yang, Yao-Der Chen, S. Lim, N. Lee, Jiang Ran, Koh Sau Wee, Q. Yong, Cao Xi, Mian Tao, J. Lo, Ricky S. W. Lee

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引用次数: 29

摘要

这项研究是针对芯片优先(芯片正面朝上)形成的扇形圆片级封装。芯片正面有铜触点垫，背面有贴片，被挑选出来，正面朝上放置在临时玻璃晶圆载体上，载体上有一层薄薄的光热转换材料。然后用环氧成型化合物(EMC)进行压缩成型，并在重构的晶圆载体上进行模后固化，然后对成型的EMC进行反磨，以暴露芯片的Cu触点垫。下一步是从铜触点焊盘上建立再分配层(rdl)，然后安装焊料球。接下来是用激光将载体剥离，然后将整个重组晶圆切割成单独的封装。我们还制作了一个封装/模比为1.8、模顶EMC帽为100 μm的300 mm重构晶圆(在重构晶圆上总共有325个测试封装)。这个测试包有三个rdl;第一个RDL的线宽/间距是5…

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Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips with Cu contact-pads on the front side and a die attach film on the backside are picked and placed face-up on a temporary-glass-wafer carrier with a thin layer of light-to-heat conversion material. It is followed by compression molding with an epoxy molding compound (EMC) and a post-mold cure on the reconstituted wafer carrier and then backgrinding the molded EMC to expose the Cu contact-pads of the chips. The next step is to build up the redistribution layers (RDLs) from the Cu contact-pads and then mount the solder balls. This is followed by the debonding of the carrier with a laser and then the dicing of the whole reconstituted wafer into individual packages. A 300-mm reconstituted wafer with a package/die ratio = 1.8 and a die-top EMC cap = 100 μm has also been fabricated (a total of 325 test packages on the reconstituted wafer). This test package has three RDLs; the line width/spacing of the first RDL is 5 ...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.