利用UV改性和高频传输特性的低衰减组装具有超光滑高粘附性的化学镀铜籽晶层的铜布线

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2020-04-01 DOI:10.4071/imaps.1100914

Masaya Toba, S. Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, S. Abe, T. Masuko, Kazuhiko Kurafuchi

引用次数: 0

摘要

采用倒装球栅阵列等多层印刷电路板的高性能器件半导体封装技术已成为实现高性能器件封装的热点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property

Abstract Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ul...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.