六面模压面板级芯片级封装(plcsp)热循环测试与仿真

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2021-04-01 DOI:10.4071/imaps.1421341

J. Lau, C. Ko, C. Peng, Tzvy-Jang Tseng, Kai-Ming Yang, T. Xia, P. Lin, E. Lin, Leo Chang, H. Liu, Curry Lin, Yan-Jun Fan, D. Cheng, Winnie Lu

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引用次数: 0

摘要

在本研究中，研究了六面模塑面板级芯片级封装（PLCSP）焊点的可靠性。重点放在印刷电路板上六面成型PLCSP的热循环测试（−55°CΔ125°C，50分钟循环）上。为了进行比较，没有六面成型（普通）PLCSP的PLCSP也进行了相同的测试。将热循环试验结果绘制为威布尔分布，并给出了90%置信度下的真实威布尔斜率和真实特性寿命。还确定了这两种情况下焊点的平均寿命比及其置信水平。此外，还提供了它们的焊点故障位置和故障模式。最后，对这两种情况进行了非线性、时间和温度相关的三维有限元模拟，并与热循环试验结果进行了关联。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)

In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a printed circuit board. For comparison purpose, the one without six-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution, and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for these two cases and correlated with the thermal cycling test results.

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.