便携式多光谱静脉成像系统

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
H. Ozkan, Muberra Aydin, O. Ozcan, Ummuhan Zengin
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引用次数: 0

摘要

摘要静脉切开术可能造成不必要的伤害,病人的静脉是不容易看到的医疗保健专业人员。为了解决这个问题,我们设计了一个新的系统来成像皮下静脉。采用微处理器、红外(红外)相机、不同波长的近红外(近红外)光源和红外带通滤波器获得多光谱图像。原始静脉图像增强,着色,并显示在显示器上使用易于使用的界面。在20名受试者中,医生在原始图像上手动指定的静脉边界与系统自动分割的静脉边界之间的平均骰子相似指数(DSI)为0.92±2.1。增强图像的平均峰值信噪比(PSNR)为68.37±1.56。使用该装置,采血师可以通过三种不同的选择方便地实时观察皮下静脉。因此,本研究推动了静脉成像领域的发展,有可能减少静脉穿刺对患者的伤害。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A portable multispectral vein imaging system
Abstract Phlebotomy may cause unnecessary injuries to a patient whose veins are not easily visible to a healthcare professional. To mitigate this problem we designed a new system to image subcutaneous veins. Multispectral images were obtained using a microprocessor, an IR (infrared) camera, different wavelengths of NIR (near-infrared) sources, and an IR band-pass filter. Raw vein images were enhanced, colored, and displayed on a monitor using an easy-to-use interface. The mean dice similarity index (DSI) between the vein border specified by a doctor on the raw images manually and the automated segmented by the proposed system is determined as 0.92 ± 2.1 for 20 subjects. Also, the average peak signal-to-noise ratio (PSNR) obtained a high value of 68.37 ± 1.56 from the enhanced image. Phlebotomists can easily observe the subcutaneous veins in real-time with the three different options using the proposed device. As a result, this study advances the vein imaging field which has the potential to reduce injury to the patient during venipuncture.
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来源期刊
Journal of Electrical Engineering-elektrotechnicky Casopis
Journal of Electrical Engineering-elektrotechnicky Casopis 工程技术-工程:电子与电气
CiteScore
1.70
自引率
12.50%
发文量
40
审稿时长
6-12 weeks
期刊介绍: The joint publication of the Slovak University of Technology, Faculty of Electrical Engineering and Information Technology, and of the Slovak Academy of Sciences, Institute of Electrical Engineering, is a wide-scope journal published bimonthly and comprising. -Automation and Control- Computer Engineering- Electronics and Microelectronics- Electro-physics and Electromagnetism- Material Science- Measurement and Metrology- Power Engineering and Energy Conversion- Signal Processing and Telecommunications
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