改善n型柔性Bi2Se3+x/PVDF复合薄膜的热电性能

Soft science Pub Date : 2021-07-01 DOI:10.20517/ss.2021.04
Q. Zou, H. Shang, Daxing Huang, Taiguang Li, Xie Bowei, H. Gu, F. Ding
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引用次数: 10

摘要

硒化铋材料(bi2se 3)在室温下具有高性能,在热电应用中表现出潜力。目前,大多数用于制备薄膜材料的真空制备技术,如磁控溅射和分子束外延,通常需要复杂和昂贵的设备。这限制了柔性热电薄膜的实际应用。本文采用简单的化学反应方法制备了具有良好柔韧性的bi2se3 +x纳米板/聚偏氟乙烯复合薄膜。系统地研究了它们的热电性能和微观结构。复合膜沿(015)表现出高度优选的取向。通过添加过量的硒元素来优化载流子浓度和迁移率,最终改善热电性能。在300 K时,优化后的功率因数为5.2 μ W/ k2m。此外,在半径为1厘米的2500次弯曲循环后,性能仍然稳定,这表明在可穿戴/便携式电子产品中有很好的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improved thermoelectric performance in n-type flexible Bi2Se3+x/PVDF composite films
Bismuth selenide materials (Bi 2 Se 3 ) have high performance around room temperature, demonstrating potential in thermoelectric applications. Presently, most vacuum preparation techniques used to fabricate the film materials, such as magnetron sputtering and molecular beam epitaxy, usually require complex and expensive equipment. This limits the practical applications of flexible thermoelectric films. Here, we prepared Bi 2 Se 3+x nanoplate/ polyvinylidene fluoride composite films with good flexibility using a facile chemical reaction method. Their thermoelectric performance and microstructures were systematically studied. The composite films exhibit a highly preferred orientation along (015). The carrier concentration and mobility were optimized by adding excessive element Se, eventually leading to an improvement in thermoelectric performance. The optimized power factor is 5.2 μ W/K 2 m at 300 K. Furthermore, the performance remains stable after 2500 bending cycles at a radius of 1 cm, suggesting promising applications in wearable/portable electronics.
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