转移模塑功率硅中的铁氧体：封装中的挑战

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2019-12-16 DOI:10.4071/IMAPS.1064487

T. Thomas, M. Dijk, M. Dreissigacker, S. Hoffmann, H. Walter, K. Becker, M. Schneider-Ramelow

引用次数: 2

摘要

摘要:当瞄准新型高功率密度系统级封装(功率sip)时，传递成型工艺正受到越来越多的关注，其中不仅晶体管和二极管，而且驱动器，通过…

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Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging

Abstract Transfer-molding process is enjoying growing interest when aiming for novel high-power density system-in-packages (power SiPs), where not only transistors and diodes but also drivers, pass...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.