316LN钢孔隙表面愈合机制的研究

IF 1.6 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
Mingli Qin, Jiansheng Liu, Jing-dan Li, Xuezhong Zhang
{"title":"316LN钢孔隙表面愈合机制的研究","authors":"Mingli Qin, Jiansheng Liu, Jing-dan Li, Xuezhong Zhang","doi":"10.1515/htmp-2022-0282","DOIUrl":null,"url":null,"abstract":"Abstract The behavior of void surface healing in 316LN steel samples undergoing thermal plasticity deformation was investigated using the Gleeble 1500 thermomechanical simulator. The characterization of the void surface after plastic deformation was analyzed under different deformation temperatures, deformation amounts, and holding time durations. The morphology evolution and microstructure of the void surface healing zone during thermal plasticity deformation and holding time duration stage were analyzed using electron back scatter diffraction imaging. The mechanism of void surface healing under thermal plasticity deformation was investigated. It was found that the degree of void surface healing increases with the degree of deformation and the duration of the holding time. Dynamic recrystallization occurred continuously at the void surface, resulting in a plethora of crystal defects and a substantial amount of energy. These conditions were conducive to atomic diffusion and migration, thereby promoting the healing process of the void surface. Maintaining high temperature after deformation can continue to provide energy for the diffusion and migration of atoms, promotes the growth of recrystallized grains, and gradually heals the void surface.","PeriodicalId":12966,"journal":{"name":"High Temperature Materials and Processes","volume":" ","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A study of the void surface healing mechanism in 316LN steel\",\"authors\":\"Mingli Qin, Jiansheng Liu, Jing-dan Li, Xuezhong Zhang\",\"doi\":\"10.1515/htmp-2022-0282\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract The behavior of void surface healing in 316LN steel samples undergoing thermal plasticity deformation was investigated using the Gleeble 1500 thermomechanical simulator. The characterization of the void surface after plastic deformation was analyzed under different deformation temperatures, deformation amounts, and holding time durations. The morphology evolution and microstructure of the void surface healing zone during thermal plasticity deformation and holding time duration stage were analyzed using electron back scatter diffraction imaging. The mechanism of void surface healing under thermal plasticity deformation was investigated. It was found that the degree of void surface healing increases with the degree of deformation and the duration of the holding time. Dynamic recrystallization occurred continuously at the void surface, resulting in a plethora of crystal defects and a substantial amount of energy. These conditions were conducive to atomic diffusion and migration, thereby promoting the healing process of the void surface. Maintaining high temperature after deformation can continue to provide energy for the diffusion and migration of atoms, promotes the growth of recrystallized grains, and gradually heals the void surface.\",\"PeriodicalId\":12966,\"journal\":{\"name\":\"High Temperature Materials and Processes\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2023-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"High Temperature Materials and Processes\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1515/htmp-2022-0282\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"High Temperature Materials and Processes","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1515/htmp-2022-0282","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

摘要

摘要利用Gleeble 1500热机械模拟机研究了316LN钢热塑性变形试样中孔隙表面的愈合行为。分析了不同变形温度、变形量和保温时间下塑性变形后孔隙表面的特征。利用电子背散射衍射成像分析了热塑性变形和保温时间阶段孔隙表面愈合区的形态演变和微观结构。研究了热塑性变形下孔隙表面愈合的机理。研究发现,孔隙表面愈合程度随着变形程度和保温时间的延长而增加。在孔隙表面连续发生动态再结晶,导致过多的晶体缺陷和大量的能量。这些条件有利于原子的扩散和迁移,从而促进空隙表面的愈合过程。变形后保持高温可以继续为原子的扩散和迁移提供能量,促进再结晶晶粒的生长,并逐渐愈合孔隙表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study of the void surface healing mechanism in 316LN steel
Abstract The behavior of void surface healing in 316LN steel samples undergoing thermal plasticity deformation was investigated using the Gleeble 1500 thermomechanical simulator. The characterization of the void surface after plastic deformation was analyzed under different deformation temperatures, deformation amounts, and holding time durations. The morphology evolution and microstructure of the void surface healing zone during thermal plasticity deformation and holding time duration stage were analyzed using electron back scatter diffraction imaging. The mechanism of void surface healing under thermal plasticity deformation was investigated. It was found that the degree of void surface healing increases with the degree of deformation and the duration of the holding time. Dynamic recrystallization occurred continuously at the void surface, resulting in a plethora of crystal defects and a substantial amount of energy. These conditions were conducive to atomic diffusion and migration, thereby promoting the healing process of the void surface. Maintaining high temperature after deformation can continue to provide energy for the diffusion and migration of atoms, promotes the growth of recrystallized grains, and gradually heals the void surface.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
High Temperature Materials and Processes
High Temperature Materials and Processes 工程技术-材料科学:综合
CiteScore
2.50
自引率
0.00%
发文量
42
审稿时长
3.9 months
期刊介绍: High Temperature Materials and Processes offers an international publication forum for new ideas, insights and results related to high-temperature materials and processes in science and technology. The journal publishes original research papers and short communications addressing topics at the forefront of high-temperature materials research including processing of various materials at high temperatures. Occasionally, reviews of a specific topic are included. The journal also publishes special issues featuring ongoing research programs as well as symposia of high-temperature materials and processes, and other related research activities. Emphasis is placed on the multi-disciplinary nature of high-temperature materials and processes for various materials in a variety of states. Such a nature of the journal will help readers who wish to become acquainted with related subjects by obtaining information of various aspects of high-temperature materials research. The increasing spread of information on these subjects will also help to shed light on relevant topics of high-temperature materials and processes outside of readers’ own core specialties.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信