集成在3D光电MID中的用于设备通信的多模总线耦合器

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2021-04-01 DOI:10.4071/imaps.1412062

L. Lorenz, K. Nieweglowski, K. Bock

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引用次数: 0

摘要

在这篇文章中，我们从理论基础、光学连续波和比特率性能到在3-D光电-MID封装中的实现，概述了非对称光学总线耦合器（AOBC）的发展。耦合器允许两个多模波导之间的无中断双向连接，根据耦合方向，在同一节点具有不同的耦合比，高达5:1的纵横比。首次使用AOBC演示了高达12.5Gbit/s的数据传输，以及将耦合元件完全实现到包括电气测试电路的3-D-Optom-MID封装中。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID

In this article, we give an overview of the development of an asymmetric optical bus coupler (AOBC) from the theoretical basis, the optical continuous wave, and bit rate performance to the implementation in a 3-D-Opto-MID package. The coupler allows for an interruption-free and bidirectional connection between two multimode waveguides, with different coupling ratios at the same node up to an aspect ratio of 5:1 depending on the coupling direction. For the first time, data transmission up to 12.5 Gbit/s is demonstrated with the AOBC, as well as the full implementation of the coupling element into a 3-D-Opto-MID package including an electrical test circuit.

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.