电子和光子材料可靠性的分析建模:透视与扩展

IF 1.5 4区 材料科学 Q3 ENGINEERING, MECHANICAL
E. Suhir
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引用次数: 0

摘要

本次审查的目的是双重的:向材料科学家、机械工程师和不涉及电子、光子学、微电子机械系统(MEMS)或MOEMS(光学MEMS)工程的可靠性物理学家展示他们可以为这一重要的“高科技”领域带来什么样的价值,以及向“高科技”工程师展示他们如何从多年来开发的应用中受益。在物理设计的一般领域中,用于各种工程和应用科学领域的材料和结构的可靠性,以及什么可以有效地应用于他们的知识体系。因此,在回顾的观点部分,一些关键的,甚至是矛盾的,即先验的非明显的,在微电子和光子材料科学,可靠性物理和结构分析中遇到的问题,使用所谓的分析(“数学”)建模来解决。扩展部分与一些具体的,主要是航空航天,可靠性概念的概率设计的最新应用和分析建模工作有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical Modeling of Electronic and Photonic Materials Reliability: Perspective and Extension
The objective of this review is double-folded: to show materials scientists, mechanical engineers and reliability physicists not involved in electronics, photonics, micro-electronic-mechanical-systems (MEMS) or MOEMS (optical MEMS) engineering what kind of value they could bring to this important “high-tech” area, as well as to demonstrate to “high-tech” engineers how they could benefit from the application of what has been developed, for many years, in the general field of physical design for reliability of materials and structures employed in various fields of engineering and applied science and what could be effectively applied to their body of knowledge. Accordingly, in the perspective part of the review some critical and even paradoxical, i.e., a-priori non-obvious, problems encountered in microelectronics and photonics materials science, reliability physics and structural analysis are addressed using what could be called analytical (“mathematical”) modeling. The extension part has to do with some specific, mostly aerospace, recent applications of the probabilistic design for reliability concept and analytical modeling effort.
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来源期刊
CiteScore
3.00
自引率
0.00%
发文量
30
审稿时长
4.5 months
期刊介绍: Multiscale characterization, modeling, and experiments; High-temperature creep, fatigue, and fracture; Elastic-plastic behavior; Environmental effects on material response, constitutive relations, materials processing, and microstructure mechanical property relationships
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