尺寸和缩放对RHBD SRAM电路功耗和弹性的影响

IF 1.1 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Testing-Theory and Applications Pub Date : 2022-11-18 DOI:10.1007/s10836-022-06036-5

Neha Pannu, N. R. Prakash, Jasbir Kaur

引用次数: 1

摘要

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Effect of Sizing and Scaling on Power Dissipation and Resilience of an RHBD SRAM Circuit

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Effect of Sizing and Scaling on Power Dissipation and Resilience of an RHBD SRAM Circuit

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来源期刊

Journal of Electronic Testing-Theory and Applications 工程技术-工程：电子与电气

CiteScore

2.00

自引率

11.10%

发文量

审稿时长

6 months

期刊介绍： The Journal of Electronic Testing: Theory and Applications is an international forum for the dissemination of research and application information in the area of electronic testing. This is the only journal devoted specifically to electronic testing. The papers for publication in Journal of Electronic Testing: Theory and Applications are selected through a peer review to ensure originality, timeliness, and relevance. The journal provides archival material, and through its quick publication cycle, strives to bring recent results to researchers and practitioners. While it emphasizes publication of preciously unpublished material, conference papers of exceptional merit that require wider exposure are, at the discretion of the editors, also published provided they meet the journal''s peer review standard. Journal of Electronic Testing: Theory and Applications also seeks clearly written survey and review articles to promote improved understanding of the state of the art. Journal of Electronic Testing: Theory and Applications coverage includes, but is not limited to the following topics: Testing of VLSI devices printed circuit boards, and electronic systems; Testing of analog and digital electronic circuits; Testing of microprocessors, memories, and signal processing devices; Fault modeling; Test generation; Fault simulation; Testability analysis; Design for testability; Synthesis for testability; Built-in self-test; Test specification; Fault tolerance; Formal verification of hardware; Simulation for verification; Design debugging; AI methods and expert systems for test and diagnosis; Automatic test equipment (ATE); Test fixtures; Electron Beam Test Systems; Test programming; Test data analysis; Economics of testing; Quality and reliability; CAD Tools; Testing of wafer-scale integration devices; Testing of reliable systems; Manufacturing yield and design for yield improvement; Failure mode analysis and process improvement