高温多层陶瓷电容器中焊料与瞬态液相烧结互连的比较

Q4 Engineering
J. Bultitude, J. McConnell, L. Jones, G. Miller, J. Magee, A. Templeton, A. Gurav, R. Phillips
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引用次数: 1

摘要

高温多层陶瓷电容器(MLCC)在井下油气勘探、军事和航空航天应用中具有150°C及更高温度的市场。为了最大限度地提高电容密度并实现高度的机械坚固性,堆叠和含铅形状因子已被使用,高熔点–含铅焊料是首选的互连。然而,含铅焊料的温度限制在300°C以下,并被禁止用于许多商业和汽车应用,未来计划通过进一步的立法限制其使用。SAC 305或SnSb合金等常见的无铅焊料广泛使用,但它们在200°C下长时间暴露时的性能有限。在组装过程中暴露于高回流温度,尤其是连续的回流操作,也可能损害互连的完整性。高温含金焊料广泛可用,但这些焊料成本高昂,因此不可行。。。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors
There is a long-established market for high temperature multilayer ceramic capacitors (MLCCs) that operate at 150°C and higher in downhole oil and gas exploration, and military and aerospace applications. To maximize the capacitance density and achieve a high degree of mechanical robustness, stacks and leaded form factors have been used with high melting point–Pb-containing solders as the preferred interconnects. However, Pb-containing solders are limited to temperatures below 300°C and are banned from many commercial and automotive applications with further legislation limiting their use planned in the future. Common Pb-free solders such as SAC 305 or SnSb alloys are in widespread use, but their performance at prolonged exposures at 200°C is limited. Exposures to high reflow temperatures during assembly, especially successive reflow operations, can also compromise interconnect integrity. Higher temperature gold-containing solders are widely available, but these are cost-prohibitive and so are not viable ...
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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