双丝+电弧增材+原位热处理制备NiTi合金的组织与力学性能

IF 2.3 4区工程技术 Q3 ENGINEERING, MANUFACTURING

3D Printing and Additive Manufacturing Pub Date : 2024-06-18 eCollection Date: 2024-06-01 DOI:10.1089/3dp.2023.0003

Jian Han, Xinya Chen, Guoyang Zhang, Bang Liu, Meiqing Meng, Yangchuan Cai, Hongbing Jiang, Mingjie Bi, Yueqian Hong, Yinbao Tian

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引用次数: 0

摘要

本研究以 TA1 和 ER-Ni 焊丝为原料，采用双丝+电弧快速成型加原位热处理的方法制备了 NiTi 形状记忆合金。结果表明，从下到上的微观结构演变为 NiTi2 + NiTi → NiTi + Ni3Ti + Ni4Ti3 → NiTi + Ni4Ti3 + Ni3Ti2 + Ni3Ti + α-Ti。复杂的热循环导致了 Ni3Ti 的析出，从而提高了基体（B2）的硬度，顶部区域的平均硬度值达到了 550.7 HV0.2。断裂应力为 2075 ± 138.4 MPa，断裂应变为 11.2 ± 1.27%。样品在循环 15 次后显示出 7.02% 的残余应变和 5.87% 的可逆应变，应力滞后随循环应变的增加而减小。

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Microstructure and Mechanical Properties of NiTi Alloy Prepared by Double-Wire + Arc Additive Manufacturing Plus In Situ Heat Treatment.

In this study, NiTi shape memory alloy was prepared by double-wire + arc additive manufacturing plus in situ heat treatment using TA1 and ER-Ni welding wires as the raw materials. The results show that the microstructural evolution from the bottom to top is NiTi₂ + NiTi → NiTi + Ni₃Ti + Ni₄Ti₃ → NiTi + Ni₄Ti₃ + Ni₃Ti₂ + Ni₃Ti + α-Ti. Complex thermal cycles led to the precipitation of Ni₃Ti, which improves the hardness of the matrix (B2), and the average hardness value of the top region reaches 550.7 HV_0.2. The fracture stress is 2075 ± 138.4 MPa and the fracture strain is 11.2 ± 1.27%. The sample shows 7.02% residual strain and 5.87% reversible strain after 15 cycles, and the stress hysteresis decreases with an increase in cyclic strain.

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来源期刊

3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)

CiteScore

6.00

自引率

6.50%

发文量

126

期刊介绍： 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.