数据中心前向和后向裂缝技术诱导压力和流场的实验与数值分析

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Mohammad I. Tradat, Yaman M. Manaserh, Ahmad R. Gharaibeh, B. Sammakia, D. Hall, K. Nemati, M. Seymour
{"title":"数据中心前向和后向裂缝技术诱导压力和流场的实验与数值分析","authors":"Mohammad I. Tradat, Yaman M. Manaserh, Ahmad R. Gharaibeh, B. Sammakia, D. Hall, K. Nemati, M. Seymour","doi":"10.1115/1.4053890","DOIUrl":null,"url":null,"abstract":"\n An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, the side effects of which are not fully understood. Therefore, it has become necessary to develop an overall understanding of backward curved blowers and compare the resulting flow, pressure, and temperature fields with forward curved ones in which the induced fields are characterized, compared and visualized in a reference data center. In this study, experimental and numerical characterization of backward curved blowers is introduced. Then, a physics-based Computational Fluid Dynamics model is built using the 6SigmaRoomTM tool to predict/simulate the measured fields. The parametric and sensitivity of the baseline modeling are investigated and considered. Different operating conditions are applied at the room level for experimental characterization, comparison, and illustration of the interaction between different CRAH technologies. The measured data is plotted and compared with the CFD model assessment to visualize the fields of interest. The results show that the fields are highly dependent on CRAH technology. The tile to CRAH airflow ratios for the flow constraints of scenarios 1, 2, 3, and 4 are 85.5%, 83.9%, 61%, and 59%, respectively. The corresponding leakage ratios are 14.5%, 16%, 38.9%, and 41%, respectively. Furthermore, the validated CFD model was used to investigate and compare the airflow pattern and plenum pressure distribution. Lastly, it is notable that a potential side effect of backward curved technology is the creation of airflow dead zone.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward Crah Technology\",\"authors\":\"Mohammad I. Tradat, Yaman M. Manaserh, Ahmad R. Gharaibeh, B. Sammakia, D. Hall, K. Nemati, M. Seymour\",\"doi\":\"10.1115/1.4053890\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, the side effects of which are not fully understood. Therefore, it has become necessary to develop an overall understanding of backward curved blowers and compare the resulting flow, pressure, and temperature fields with forward curved ones in which the induced fields are characterized, compared and visualized in a reference data center. In this study, experimental and numerical characterization of backward curved blowers is introduced. Then, a physics-based Computational Fluid Dynamics model is built using the 6SigmaRoomTM tool to predict/simulate the measured fields. The parametric and sensitivity of the baseline modeling are investigated and considered. Different operating conditions are applied at the room level for experimental characterization, comparison, and illustration of the interaction between different CRAH technologies. The measured data is plotted and compared with the CFD model assessment to visualize the fields of interest. The results show that the fields are highly dependent on CRAH technology. The tile to CRAH airflow ratios for the flow constraints of scenarios 1, 2, 3, and 4 are 85.5%, 83.9%, 61%, and 59%, respectively. The corresponding leakage ratios are 14.5%, 16%, 38.9%, and 41%, respectively. Furthermore, the validated CFD model was used to investigate and compare the airflow pattern and plenum pressure distribution. Lastly, it is notable that a potential side effect of backward curved technology is the creation of airflow dead zone.\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2022-02-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4053890\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4053890","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2

摘要

在数据中心热管理中,一种越来越常见的节能做法是用电子换向插头式风扇更换空气冷却单元鼓风机,其副作用尚不完全清楚。因此,有必要全面了解后向弯曲鼓风机,并将由此产生的流量、压力和温度场与前向弯曲鼓风机进行比较,其中诱导场在参考数据中心中进行表征、比较和可视化。在本研究中,介绍了后向弯曲鼓风机的实验和数值特性。然后,使用6SigmaRoomTM工具建立了基于物理的计算流体动力学模型,以预测/模拟测量场。研究并考虑了基线建模的参数和灵敏度。在房间级别应用不同的操作条件进行实验表征、比较和说明不同CRAH技术之间的相互作用。绘制测量数据,并将其与CFD模型评估进行比较,以可视化感兴趣的领域。结果表明,这些领域高度依赖CRAH技术。场景1、2、3和4的流量约束的瓦片与CRAH的气流比分别为85.5%、83.9%、61%和59%。相应的泄漏率分别为14.5%、16%、38.9%和41%。此外,使用经过验证的CFD模型对气流模式和增压室压力分布进行了研究和比较。最后,值得注意的是,后向弯曲技术的一个潜在副作用是产生气流死区。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward Crah Technology
An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, the side effects of which are not fully understood. Therefore, it has become necessary to develop an overall understanding of backward curved blowers and compare the resulting flow, pressure, and temperature fields with forward curved ones in which the induced fields are characterized, compared and visualized in a reference data center. In this study, experimental and numerical characterization of backward curved blowers is introduced. Then, a physics-based Computational Fluid Dynamics model is built using the 6SigmaRoomTM tool to predict/simulate the measured fields. The parametric and sensitivity of the baseline modeling are investigated and considered. Different operating conditions are applied at the room level for experimental characterization, comparison, and illustration of the interaction between different CRAH technologies. The measured data is plotted and compared with the CFD model assessment to visualize the fields of interest. The results show that the fields are highly dependent on CRAH technology. The tile to CRAH airflow ratios for the flow constraints of scenarios 1, 2, 3, and 4 are 85.5%, 83.9%, 61%, and 59%, respectively. The corresponding leakage ratios are 14.5%, 16%, 38.9%, and 41%, respectively. Furthermore, the validated CFD model was used to investigate and compare the airflow pattern and plenum pressure distribution. Lastly, it is notable that a potential side effect of backward curved technology is the creation of airflow dead zone.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信