双脉冲飞秒激光烧结抑制金属纳米颗粒烧蚀

IF 2.3 4区 工程技术 Q3 ENGINEERING, MANUFACTURING
3D Printing and Additive Manufacturing Pub Date : 2024-04-01 Epub Date: 2024-04-16 DOI:10.1089/3dp.2022.0229
Janghan Park, Zefang Ye, Hugo Celio, Yaguo Wang
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引用次数: 0

摘要

作为激光粉末床熔融的一个分支,利用飞秒(fs)激光和金属纳米颗粒(NPs)进行选择性激光烧结(SLS),由于脉冲持续时间极短,可以实现高精度、高密度的亚微米特征,并降低残余应力。由于热电子效应导致的烧蚀,用 fs 激光成功烧结金属 NPs 具有挑战性。在这项研究中,我们提出了一种双脉冲烧结策略,即使用一对延时fs激光脉冲来控制电子温度,同时保持足够高的晶格温度。我们证明,当延迟时间略长于 Cu NPs 的电子-声子耦合时间时,烧蚀面积会急剧缩小,成功烧结的功率窗口也会扩大约两倍。同时,热影响区可缩小 66%(面积)。这种新策略可用于所有使用 fs 激光的 SLS 过程,并在未来应用中释放出使用 fs 激光的 SLS 的威力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Suppressing Metal Nanoparticle Ablation with Double-Pulse Femtosecond Laser Sintering.

As a branch of laser powder bed fusion, selective laser sintering (SLS) with femtosecond (fs) lasers and metal nanoparticles (NPs) can achieve high precision and dense submicron features with reduced residual stress, due to the extremely short pulse duration. Successful sintering of metal NPs with fs laser is challenging due to the ablation caused by hot electron effects. In this study, a double-pulse sintering strategy with a pair of time-delayed fs-laser pulses is proposed for controlling the electron temperature while still maintaining a high enough lattice temperature. We demonstrate that when delay time is slightly longer than the electron-phonon coupling time of Cu NPs, the ablation area was drastically reduced and the power window for successful sintering was extended by about two times. Simultaneously, the heat-affected zone can be reduced by 66% (area). This new strategy can be adopted for all the SLS processes with fs laser and unlock the power of SLS with fs lasers for future applications.

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来源期刊
3D Printing and Additive Manufacturing
3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)
CiteScore
6.00
自引率
6.50%
发文量
126
期刊介绍: 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.
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