高空电子设备冷却性能的实验研究

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2019-06-27 DOI:10.4071/IMAPS.871683

Han-Yun Jhang, M. Ho, Cho-Han Lee, Fang-Shou Lee

引用次数: 0

摘要

在数据中心的整体功耗方面，冷却是成本高昂的因素之一。在过去的几十年里，传统的冷却方法维持了该设施的设备…

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Experimental Studies of Electronics Cooling Capabilities at High Altitude

Abstract Cooling is one of the costly factors in data centers in terms of overall power consumption. Over the past few decades, traditional cooling approaches have maintained the facility's equipme...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.