电子封装中多尺度结构弹塑性问题的Fem-bem自动耦合方法

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
F. Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
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引用次数: 1

摘要

我们介绍了一种用于多尺度电子封装结构弹塑性分析的有限元和边界元耦合方法。基于FE-BE耦合算法,针对弹性问题,介绍了一种自动实现Abaqus与自写弹性BE码耦合的过程。在混合FEM-BEM模型中,界面边界处的有效刚度和有效力通过自行编写的BE程序进行评估。然后,使用Abaqus中的用户子程序(UEL)将获得的有效刚度和有效力组装到全局有限元公式中。利用有限元理论对具有塑性变形、应力集中等情况的结构进行了数值模拟。边界元法适用于具有大型结构的线弹性域。与目前可用于多尺度电子封装结构的分析方法相比,所提出的方法提供了几个关键改进。其优点是:(i)ABAQUS强大的预处理和后处理功能;(ii)解的精度越高;(iii)通过使用该方案可以减少计算成本和时间;以及(iv)通过使用边界元作为补充来求解具有无限可拓性的系统。此外,我们还证明了所提出的方法处理电子封装问题中的多尺度结构的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging
We introduce a coupled finite and boundary element method for elastic-plastic analysis over multiscale electronic packaging structures. Based on the FE-BE coupling algorithm, an automatic implementation procedure for the coupling of the Abaqus with a self-written elastic BE code is introduced for elastic problems. In the mixed FEM-BEM model, the effective stiffness and effective forces at the interfacial boundary are evaluated by the self-written BE code. Then, the obtained effective stiffness and effective forces are assembled to the global FE formulations by using the user subroutine (UEL) in Abaqus. Numerical simulation of structures with plastic deformation, stress concentration, etc. is carried out by using FEM theory. The boundary element method is used for linear elastic domains with large-scale structure. The proposed method offers several key improvements compared with current analysis methods available for multi-scale electronic packaging structures. The benefits are: (i) the powerful pre- and post-processing of ABAQUS; (ii) the higher accuracy of the solution; (iii) the computational cost and time can be reduced by using the scheme; and (iv) solving systems with infinite extension by using the BEM as a supplement. Furthermore, we demonstrate the ability of the proposed approach to handle multiscale structures in electronic packaging problems.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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