钛铜合金的原位线+粉同步电弧增材制造

IF 2.3 4区工程技术 Q3 ENGINEERING, MANUFACTURING

3D Printing and Additive Manufacturing Pub Date : 2024-02-01 Epub Date: 2024-02-15 DOI:10.1089/3dp.2022.0378

Chuanchu Su, Yanhu Wang, Weimin Wu, Sergey Konovalov, Lei Huang, Xizhang Chen, Shuyang Qin

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引用次数: 0

摘要

本研究采用新型线材+粉末同步电弧增材制造技术制造钛铜合金。研究了制成合金的微观结构和性能。结果表明，制备的 Ti-Cu 合金具有良好的性能。具有高生长限制因子的铜可以增加 Ti-Cu 合金中的立宪过冷区，从而克服制造过程中高热梯度的负面影响。通过观察微观结构，印制的 Ti-Cu 合金试样具有等轴细晶粒微观结构。通过腐蚀性能分析，Cu 还能使合金的钝化膜更加致密，使合金更耐腐蚀。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

In Situ Wire + Powder Synchronous Arc Additive Manufacturing of Ti-Cu Alloys.

In this study, a new wire + powder synchronous arc additive manufacturing technique was used to manufacture Ti-Cu alloys. The microstructure and properties of the as-fabricated alloys were studied. The results showed that the prepared Ti-Cu alloys have good properties. The Cu with high growth restriction factor can increase the constitutional supercooling zone in the Ti-Cu alloys, which can override the negative effect of a high thermal gradient in the manufacturing process. Through the observation of the microstructure, the as-printed Ti-Cu alloy specimens have equiaxed fine-grained microstructure. Through corrosion performance analysis, the Cu can also make the passivation film of the alloy more compact and make the alloy more corrosion resistant.

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来源期刊

3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)

CiteScore

6.00

自引率

6.50%

发文量

126

期刊介绍： 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.