模拟金星环境中Pt/HTCC氧化铝封装原型的60个地球日试验

Q4 Engineering
Liangyu Chen, P. Neudeck, R. Meredith, D. Lukco, D. Spry, L. Nakley, K. Phillips, G. Beheim, G. Hunter
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引用次数: 7

摘要

本文介绍了具有Au/Pt金属化的原型高温共烧陶瓷(HTCC)封装在三阶段恶劣环境测试中的实验结果,最终在由465°C腐蚀性大气和90巴压力组成的模拟金星表面环境中进行了60天的演示。原型封装基于先前开发和报道的HTCC封装,该封装在500°C的地-空气环境中用多个模拟和数字碳化硅高温半导体集成电路成功测试了10000多小时,并在800°C以上的温度下进行了短期测试。三阶段恶劣环境试验开始于在465°C的地球空气中48小时,然后在90巴压力下在465℃的氮气中48小时和在90巴腐蚀性大气465°C的模拟金星表面环境中1400小时。除了在三相恶劣环境中进行现场电气测试和测试后电气诊断外,还对包装材料和表面进行了初步测试后分析,以评估包装材料在测试环境中的稳定性以及测试后的表面条件。在模拟金星环境中的测试是在美国国家航空航天局格伦极端环境试验台上进行的。这项研究的结果表明,表面金属化区域和附近区域的有效封装可能有助于改善金星环境中HTCC氧化铝封装系统的长期电气性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment
This article presents experimental results of a prototype high-temperature cofired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with a 60-d demonstration in a simulated Venus surface environment consisting of a 465°C corrosive atmosphere at 90 bar pressure. The prototype package is based on a previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide high-temperature semiconductor integrated circuits in 500°C Earth air ambient for more than 10,000 hours, and short-term tested at temperatures above 800°C. The three-phase harsh environment test started with 48 h in 465°C Earth air, followed by 48 h in 465°C nitrogen at 90 bar pressure and 1,400 h in a simulated Venus surface environment of 465°C corrosive atmosphere at 90 bar. In addition to in situ electrical tests in a three-phase harsh environment and posttest electrical diagnosis, initial posttest analysis of the package materials and surfaces was performed to assess the stability of the packaging materials in the testing environments, as well as the surface conditions after the test. The test in the simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig. The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help improve the long-term electrical performance of an HTCC alumina packaging system in a Venus environment.
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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