高CRI LED室内照明模块的热应力分析

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2018-07-01 DOI:10.4071/IMAPS.655549

Jonghwan Lee, K. Kwon

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引用次数: 0

摘要

本研究旨在开发一种新型的发光二极管（LED）室内照明模块，其显色指数大于95。当LED工作时，会产生电能并释放热量。散热失效会降低性能并缩短使用寿命。为了有效地管理热问题，本研究测试了几种方法。散热器设计用于吸收和传递LED模块的热量。为了有效地分析所设计的LED产品的热流和热应力，实现了六面体网格生成。进行传热分析以找到最佳的导电材料。这项研究的结果提出了LED产品的最佳材料，并显示了热传递模拟的结果。

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Thermal Stress Analysis for High CRI LED Indoor Lighting Module

This research is for developing a new light emitting diode (LED) indoor lighting module with high color rendering index greater than 95. When the LED is operated, electrical energy is generated and heat is released. The failing of heat dispersal degrades the performance and decreases the operating life. To manage the thermal problem effectively, several approaches have been tested in this research study. A heat sink is designed to absorb and transfer heat from the LED module. To analyze the heat flow and thermal stress of the designed LED products effectively, hexahedral mesh generation has been implemented. Heat transfer analysis was performed to find an optimal conductive material. The outcomes of this research study suggest the best material for LED products and show the result of thermal transfer simulation.

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.