无裂纹光子晶体组装:基本原理、新兴策略与展望

IF 14 Q1 CHEMISTRY, MULTIDISCIPLINARY
An-Quan Xie, Qing Li, Yiran Xi, Liangliang Zhu* and Su Chen*, 
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引用次数: 4

摘要

具有周期性排列结构的光子晶体由于其独特的光子带隙(PBG)特性而引起了人们对光子运动调控的极大兴趣,光子带隙可以阻挡特定电磁波的传播。PBG是由结构块和周围介质之间的折射率周期性调制产生的,当PBG位于可见光谱中时,可以产生生动的结构颜色。由于在可见光范围内操纵和控制光子的特殊特性,PC在彩色标牌、显示、生物和化学传感器、检测、光电器件等方面的各种应用受到了广泛的关注。值得注意的是,pc早就存在于自然界中,如宝石蛋白石,这是天然的硅胶颗粒聚集体。许多生物也含有PC纳米结构以适应自然,如蝴蝶、孔雀、变色龙等。受大自然的启发,胶体纳米粒子自下而上的自组装已被证明是一种方便的人工构建PC纳米结构的方法。与原子化学键合合成新的化合物分子类似,胶体纳米颗粒可以通过物理或化学驱动力驱动形成具有周期性有序结构的聚集体,如毛细力和表面张力、氢键、范德华力等。通常,这种纳米颗粒由SiO2、ZnO、Fe3O4或有机聚合物(聚苯乙烯(PS)、聚甲基丙烯酸甲酯(PMMA)、聚丙烯酸(PAA)等)组成。纳米粒子的组装过程由优先的热力学态控制,以最小的自由能堆叠在一起。然而,胶体纳米颗粒的自组装容易受到各种外部因素(溶剂、底物、温度、浓度、zeta电位、pH等)的影响,不小心导致不利缺陷的形成。大规模制备无裂纹pc是pc工业化实际应用的关键限制。近年来,胶体PC装配过程中缺陷产生的机理及消除方法的研究已成为一个重要的研究热点。本文综述了无裂纹pc装配方法的研究进展,包括pc装配的基本理论、基于装配驱动力操纵的装配缺陷的形成机理和消除方法,以及开发高质量的胶体纳米颗粒。我们概述了PC自组装过程中裂纹产生的三种主要机制,其中详细讨论了受外界因素影响而导致胶体粒子组装动态平衡被打破的组装驱动力。随后,一系列的裂缝消除策略,如新型高性能装配单元的制备(丙烯酸酯、叔碳和氟化胶体颗粒)和各种装配驱动力的引入,包括疏水力驱动组装(HFDA)、分子表面力辅助组装(MSFA)、软基诱导组装(SSA)、“胶体皮”增强组装(CSE)、模板辅助方法(TA)、旋涂、综述了逐层堆焊转移(LST)技术、喷墨打印技术、离心辅助组装(CA)技术、微流控技术和改进的垂直沉积技术。最后展望了实现大面积、快速、高结晶度、无裂纹、结构色彩鲜艳的PC的高效工艺,以促进PC材料的产业化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Assembly of Crack-Free Photonic Crystals: Fundamentals, Emerging Strategies, and Perspectives

Assembly of Crack-Free Photonic Crystals: Fundamentals, Emerging Strategies, and Perspectives

Photonic crystals (PCs) with a periodically arranged structure have aroused enormous interest in the regulation of photon motion for their unique property of a photonic band gap (PBG), which can block the propagation of specific electromagnetic waves. The PBG is generated by the periodic modulation of the refractive indices between the building blocks and surrounding medium, which could lead to a vivid structural color when PBG is located in the visible spectra. Because of the special properties of maneuvering and controlling photons in the visible range, considerable attention has been devoted to the PC in relation to various applications in color signage, display, biological and chemical sensors, detection, optoelectronic devices, etc. Notably, PCs have long existed in nature, such as gem opals, which are natural silica gel particle aggregations. Many creatures also comprise the PC nanostructures to adapt to nature, for example, butterfly, peacock, chameleon, and so forth. Inspired by nature, the bottom-up self-assembly of colloidal nanoparticles has been manifested to be a convenient manmade method to construct PC nanostructures. Similar to the synthesis of new compound molecules by the chemical bonding of atoms, colloidal nanoparticles can be driven to form aggregates with a periodic ordered structure by physical or chemical driving forces, such as capillary forces and surface tension, hydrogen bonds, van der Waals forces, etc. Typically, such nanoparticles consist of SiO2, ZnO, Fe3O4, or organic polymers (polystyrene (PS), poly(methyl methacrylate) (PMMA), poly(acrylic acid) (PAA), etc.). The nanoparticle assembly process is governed by preferential thermodynamic states to stack together in a minimized free energy. However, the self-assembly of colloidal nanoparticles is easily susceptible to various external factors (solvent, substrate, temperature, concentration, zeta potential, pH, etc.), accidentally leading to the formation of unfavorable defects. Large-scale preparation of crack-free PCs is the critical limit for real-world application of PCs industrialization. Recently, the research on the mechanism and eliminating methods of defect creation in the colloidal PC assembly process has become an important research hotspot. This Account reviews the research progress on the crack-free PCs assembly methods, including the fundamental theory of PCs assembly, the formation mechanisms and elimination methods of assembly defects based on the assembly driving force manipulation, and developing high-quality colloidal nanoparticles. We outline three main mechanisms of crack generation during PC self-assembly, in which the assembly driving forces that are influenced by external factors to break the dynamic balance of colloidal particle assembly are discussed in detail. Subsequently, a series of crack elimination strategies, like novel high-performance assembly unit preparation (acrylic ester, tertiary-carbon, and fluorinated colloidal particles) and various assembly driving forces introduction, including hydrophobic force driving assembly (HFDA), molecular surface force-assisted assembly (MSFA), soft substrate-induced assembly (SSA), “colloid skin” enhanced assembly (CSE), template-assisted method (TA), spin-coating, layer-by-layer scooping transfer (LST) technique, inkjet printing, centrifugation-assisted assembly (CA), microfluidic technique, and modified vertical deposition method, are summarized. Eventually, we provide an outlook on more efficient techniques that can accomplish large-area and rapid construction of PCs with high crystallinity, no cracks, and vivid structure color to promote the industrialization of PC materials.

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