{"title":"通过DLP和DIW增材制造技术制造的柔性和多材料本质导电聚合物器件","authors":"K. Engel, P. Kilmartin, O. Diegel","doi":"10.1108/rpj-02-2023-0037","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.\n\n\nDesign/methodology/approach\nIn this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.\n\n\nFindings\nCyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.\n\n\nPractical implications\nThese findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.\n\n\nOriginality/value\nSeveral original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.\n","PeriodicalId":20981,"journal":{"name":"Rapid Prototyping Journal","volume":" ","pages":""},"PeriodicalIF":3.4000,"publicationDate":"2023-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques\",\"authors\":\"K. Engel, P. Kilmartin, O. Diegel\",\"doi\":\"10.1108/rpj-02-2023-0037\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nThe purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.\\n\\n\\nDesign/methodology/approach\\nIn this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.\\n\\n\\nFindings\\nCyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.\\n\\n\\nPractical implications\\nThese findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.\\n\\n\\nOriginality/value\\nSeveral original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.\\n\",\"PeriodicalId\":20981,\"journal\":{\"name\":\"Rapid Prototyping Journal\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":3.4000,\"publicationDate\":\"2023-08-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Rapid Prototyping Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/rpj-02-2023-0037\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rapid Prototyping Journal","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/rpj-02-2023-0037","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques
Purpose
The purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.
Design/methodology/approach
In this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.
Findings
Cyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.
Practical implications
These findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.
Originality/value
Several original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.
期刊介绍:
Rapid Prototyping Journal concentrates on development in a manufacturing environment but covers applications in other areas, such as medicine and construction. All papers published in this field are scattered over a wide range of international publications, none of which actually specializes in this particular discipline, this journal is a vital resource for anyone involved in additive manufacturing. It draws together important refereed papers on all aspects of AM from distinguished sources all over the world, to give a truly international perspective on this dynamic and exciting area.
-Benchmarking – certification and qualification in AM-
Mass customisation in AM-
Design for AM-
Materials aspects-
Reviews of processes/applications-
CAD and other software aspects-
Enhancement of existing processes-
Integration with design process-
Management implications-
New AM processes-
Novel applications of AM parts-
AM for tooling-
Medical applications-
Reverse engineering in relation to AM-
Additive & Subtractive hybrid manufacturing-
Industrialisation