通过DLP和DIW增材制造技术制造的柔性和多材料本质导电聚合物器件

IF 3.4 4区 工程技术 Q1 ENGINEERING, MECHANICAL
K. Engel, P. Kilmartin, O. Diegel
{"title":"通过DLP和DIW增材制造技术制造的柔性和多材料本质导电聚合物器件","authors":"K. Engel, P. Kilmartin, O. Diegel","doi":"10.1108/rpj-02-2023-0037","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.\n\n\nDesign/methodology/approach\nIn this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.\n\n\nFindings\nCyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.\n\n\nPractical implications\nThese findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.\n\n\nOriginality/value\nSeveral original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.\n","PeriodicalId":20981,"journal":{"name":"Rapid Prototyping Journal","volume":null,"pages":null},"PeriodicalIF":3.4000,"publicationDate":"2023-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques\",\"authors\":\"K. Engel, P. Kilmartin, O. Diegel\",\"doi\":\"10.1108/rpj-02-2023-0037\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nThe purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.\\n\\n\\nDesign/methodology/approach\\nIn this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.\\n\\n\\nFindings\\nCyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.\\n\\n\\nPractical implications\\nThese findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.\\n\\n\\nOriginality/value\\nSeveral original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.\\n\",\"PeriodicalId\":20981,\"journal\":{\"name\":\"Rapid Prototyping Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.4000,\"publicationDate\":\"2023-08-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Rapid Prototyping Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/rpj-02-2023-0037\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rapid Prototyping Journal","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/rpj-02-2023-0037","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0

摘要

目的探索新型导电光树脂的合成方法,制备可用于增材制造的柔性导电复合材料。本研究旨在利用直接墨水书写(DIW)增材制造技术,探索具有导电和绝缘元件的多材料器件的制造方法。利用数字光处理(DLP)增材制造,本研究旨在以比材料挤压3D打印系统更高的分辨率制造详细的物体。设计/方法/方法本文制备了几种用于DIW和DLP增材制造的光固化导电树脂。然后使用405 nm的近紫外光固化这些树脂,以创建本质导电聚合物(ICP)复合材料。分析了复合材料的电化学性能,确定了共聚物选择和交联密度对复合材料性能的影响。这些结果确定了随后使用DIW和DLP进行增材制造的合适树脂。这些3D打印技术被用于开发亚毫米分辨率的柔性导电装置,这些装置是用未经修改的商用3D打印机制造的。通过对导电树脂的循环伏安法和体积电导率分析,确定了最适合3D打印的导电树脂配方。导电器件是使用这两种3D打印技术制造的。采用DIW技术制备了一种多材料软导电器件,各导电元件之间相互绝缘。利用DLP制备了具有良好XY分辨率的软导电器件,最小特征尺寸为0.2 mm。所有设备都是在未经修改的商用3D打印机上制备的。这些发现对软机器人、人造肌肉和可穿戴传感器的发展具有重要价值。此外,本工作重点介绍了DIW和DLP增材制造技术。几个原创的导电树脂配方被开发用于两个3D打印系统。由此产生的3d打印复合材料柔软柔韧,同时保持其导电性能。这些发现对聚合物化学家和增材制造领域都有价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques
Purpose The purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems. Design/methodology/approach In this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers. Findings Cyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers. Practical implications These findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing. Originality/value Several original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.
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来源期刊
Rapid Prototyping Journal
Rapid Prototyping Journal 工程技术-材料科学:综合
CiteScore
8.30
自引率
10.30%
发文量
137
审稿时长
4.6 months
期刊介绍: Rapid Prototyping Journal concentrates on development in a manufacturing environment but covers applications in other areas, such as medicine and construction. All papers published in this field are scattered over a wide range of international publications, none of which actually specializes in this particular discipline, this journal is a vital resource for anyone involved in additive manufacturing. It draws together important refereed papers on all aspects of AM from distinguished sources all over the world, to give a truly international perspective on this dynamic and exciting area. -Benchmarking – certification and qualification in AM- Mass customisation in AM- Design for AM- Materials aspects- Reviews of processes/applications- CAD and other software aspects- Enhancement of existing processes- Integration with design process- Management implications- New AM processes- Novel applications of AM parts- AM for tooling- Medical applications- Reverse engineering in relation to AM- Additive & Subtractive hybrid manufacturing- Industrialisation
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