Turarova Marzhan, Mirgalikyzy Tolkyn, Mukanova Balgaisha, M. Igor
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ELIMINATION OF THE GROUND SURFACE TOPOGRAPHIC EFFECT IN THE 2D INVERSION RESULTS OF ELECTRICAL RESISTIVITY TOMOGRAPHY DATA
This paper presents the results of a study that was conducted on the development of an alternative topographic effect elimination method at the 2D data inversion. Today, the problem of the ground surface topographic effect is being solved by correcting electrical resistivity tomography data and including topography in the inversion model meshes. In this paper, we studied the effectiveness of eliminating the ground surface topographic effect using inversion methods that form the basis of most 2D and 3D inversion programs. We then developed and tested a ground surface topographic effect elimination method by cor- recting apparent resistivity values for 2D inversion. We used the integral equation method to model apparent resistivity curves. Applying the developed ground surface topographic effect elimination method allowed obtaining more accurate inversion results. Application of the proposed method in geophysical surveys will more accurately exclude the topographic effect at the inversion of the observed data.
期刊介绍:
Eurasian Journal of Mathematical and Computer Applications (EJMCA) publishes carefully selected original research papers in all areas of Applied mathematics first of all from Europe and Asia. However papers by mathematicians from other continents are also welcome. From time to time Eurasian Journal of Mathematical and Computer Applications (EJMCA) will also publish survey papers. Eurasian Mathematical Journal publishes 4 issues in a year. A working language of the journal is English. Main topics are: - Mathematical methods and modeling in mechanics, mining, biology, geophysics, electrodynamics, acoustics, industry. - Inverse problems of mathematical physics: theory and computational approaches. - Medical and industry tomography. - Computer applications: distributed information systems, decision-making systems, embedded systems, information security, graphics.