胶体银活化化学镀铜

IF 0.9 Q3 Engineering

Surface Engineering and Applied Electrochemistry Pub Date : 2023-09-04 DOI:10.3103/S1068375523040166

Xu Wang, Weiwu Ma, Zhangcong Cai

{"title":"胶体银活化化学镀铜","authors":"Xu Wang, Weiwu Ma, Zhangcong Cai","doi":"10.3103/S1068375523040166","DOIUrl":null,"url":null,"abstract":"<p>Palladium is commonly used as a catalyst in the process of surface metallization of acrylonitrile-butadiene-styrene (ABS), but since palladium is expensive, alternatives are sought. In this study, colloidal silver was used as the catalyst to metallize an ABS surface, and the effect of colloidal silver on the electroless copper plating of the ABS surface under different conditions was studied. The average bonding strength was 1.37 kN/m, which is much higher than that of palladium colloid. The experimental results show that colloidal silver has good catalytic activity, and it is expected to be used in metallization of industrial non-conductive surfaces.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2023-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Colloidal Silver Activation for Electroless Copper Deposition\",\"authors\":\"Xu Wang, Weiwu Ma, Zhangcong Cai\",\"doi\":\"10.3103/S1068375523040166\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Palladium is commonly used as a catalyst in the process of surface metallization of acrylonitrile-butadiene-styrene (ABS), but since palladium is expensive, alternatives are sought. In this study, colloidal silver was used as the catalyst to metallize an ABS surface, and the effect of colloidal silver on the electroless copper plating of the ABS surface under different conditions was studied. The average bonding strength was 1.37 kN/m, which is much higher than that of palladium colloid. The experimental results show that colloidal silver has good catalytic activity, and it is expected to be used in metallization of industrial non-conductive surfaces.</p>\",\"PeriodicalId\":782,\"journal\":{\"name\":\"Surface Engineering and Applied Electrochemistry\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.9000,\"publicationDate\":\"2023-09-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface Engineering and Applied Electrochemistry\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.3103/S1068375523040166\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface Engineering and Applied Electrochemistry","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.3103/S1068375523040166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}

引用次数: 0

摘要

钯是丙烯腈-丁二烯-苯乙烯(ABS)表面金属化过程中常用的催化剂，但由于钯价格昂贵，一直在寻找替代品。本研究以胶体银为催化剂对ABS表面进行金属化，研究了不同条件下胶体银对ABS表面化学镀铜的影响。平均结合强度为1.37 kN/m，远高于钯胶体。实验结果表明，胶体银具有良好的催化活性，有望应用于工业非导电表面的金属化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Colloidal Silver Activation for Electroless Copper Deposition

查看原文本刊更多论文

Colloidal Silver Activation for Electroless Copper Deposition

Palladium is commonly used as a catalyst in the process of surface metallization of acrylonitrile-butadiene-styrene (ABS), but since palladium is expensive, alternatives are sought. In this study, colloidal silver was used as the catalyst to metallize an ABS surface, and the effect of colloidal silver on the electroless copper plating of the ABS surface under different conditions was studied. The average bonding strength was 1.37 kN/m, which is much higher than that of palladium colloid. The experimental results show that colloidal silver has good catalytic activity, and it is expected to be used in metallization of industrial non-conductive surfaces.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Surface Engineering and Applied Electrochemistry Engineering-Industrial and Manufacturing Engineering

CiteScore

1.60

自引率

22.20%

发文量

期刊介绍： Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.