激光微加工在半导体材料中的空穴形成

IF 1.1 Q4 ELECTROCHEMISTRY

Surface Engineering and Applied Electrochemistry Pub Date : 2023-09-04 DOI:10.3103/S1068375523040075

V. L. Lanin, I. B. Petuhov, G. E. Retsiukhin

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引用次数: 0

摘要

摘要研究了EM-4452-1激光加工单元在10 ~ 300 kHz的皮秒激光脉冲重复频率下，在10 μJ的辐射能量下，激光在半导体衬底上形成微孔的过程。电镜扫描系统的高速激光束运动和被加工材料的精确定位相结合，提高了激光微加工的效率，扩展了设备的功能能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Hole Formation in Semiconductor Materials by Laser Microprocessing

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Hole Formation in Semiconductor Materials by Laser Microprocessing

Abstract—

The process of laser formation of microholes in semiconductor substrates using an EM-4452-1 laser-processing unit with a pulse repetition frequency of a picosecond laser from 10 to 300 kHz at a radiation energy up to 10 μJ is investigated. The combination of high-speed movements of the laser beam by the galvanoscanner system and precise positioning of the processed material increases the efficiency of laser microprocessing and expands the functional capabilities of the equipment.

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来源期刊

Surface Engineering and Applied Electrochemistry Engineering-Industrial and Manufacturing Engineering

CiteScore

1.70

自引率

22.20%

发文量

审稿时长

6 months

期刊介绍： Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.