航天应用封装中系统的电热分析

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Hao-hang Su, Shuai Fu, Su Li, J. Bian
{"title":"航天应用封装中系统的电热分析","authors":"Hao-hang Su, Shuai Fu, Su Li, J. Bian","doi":"10.1115/1.4054462","DOIUrl":null,"url":null,"abstract":"\n Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electro-Thermal Analysis of System in Package for Aerospace Application\",\"authors\":\"Hao-hang Su, Shuai Fu, Su Li, J. Bian\",\"doi\":\"10.1115/1.4054462\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4054462\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4054462","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2

摘要

针对航天电子产品在复杂空间环境下的故障问题,采用电热耦合方法对基于集成成型封装的10通道独立可调电压转换SIP模块的可靠性进行了分析,该模块为遥感相机探测器提供电压。首先,基于SIP模块建立了电磁模型和热模型;其次,对正常环境下三种工况在不同温度下的电热耦合进行了仿真,计算了SIP的最高温度;然后,还计算了SIP在真空和45℃下的温度?分析空间工作环境中的最高温度;最后,对SIP产品进行了测试。与实测结果相比,电热耦合法比传统的热法具有更高的精度。在正常环境下,其温度相对误差为2.8%?环境中,其温度相对误差为9%?该方法保证了SIP的性能和设计的准确性,验证了航天SIP模块的早期可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electro-Thermal Analysis of System in Package for Aerospace Application
Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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