{"title":"航天应用封装中系统的电热分析","authors":"Hao-hang Su, Shuai Fu, Su Li, J. Bian","doi":"10.1115/1.4054462","DOIUrl":null,"url":null,"abstract":"\n Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electro-Thermal Analysis of System in Package for Aerospace Application\",\"authors\":\"Hao-hang Su, Shuai Fu, Su Li, J. Bian\",\"doi\":\"10.1115/1.4054462\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4054462\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4054462","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Electro-Thermal Analysis of System in Package for Aerospace Application
Aiming at the failure problem of aerospace electronic product at the complex space environment, the electro-thermal coupling method has been used to analyze the reliability of the 10 channels independently adjustable voltage conversion SIP module based on integrated forming package, which has supply the voltage to the remote sensing camera detector. Firstly, the electromagnetic model and thermal model have been made based on the SIP module; secondly, the electro-thermal coupling simulation at different temperature of three working condition at normal environment have been made, and the maximum temperature of the SIP has been calculated; then, the temperature of the SIP has been also calculated under vacuum and 45 ? to analyzing maximum temperatures in the space work environment; at last, some test have been made of the SIP product. Compared with the measured results, the electro-thermal coupling method has much more accurate than traditional thermal method. At normal environment, the temperature relative error of which is 2.8%. At vacuum and 45 ? environment, the temperature relative error of which is 9%?This method ensured the performance and accurate of the design of the SIP, and which has verified the reliability of aerospace SIP module at early stage.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.