Lou Schuler, L. Chamoin, Z. Khatir, M. Berkani, M. Ouhab, N. Degrenne
{"title":"基于适当广义分解的光功率模块寿命快速分析简化模型","authors":"Lou Schuler, L. Chamoin, Z. Khatir, M. Berkani, M. Ouhab, N. Degrenne","doi":"10.1115/1.4053767","DOIUrl":null,"url":null,"abstract":"\n A reduced weakly-coupled thermo-mechanical model based on the Proper Generalized Decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online post-processing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Reduced Model Based On Proper Generalized Decomposition for the Fast Analysis of Igbt Power Modules Lifetime\",\"authors\":\"Lou Schuler, L. Chamoin, Z. Khatir, M. Berkani, M. Ouhab, N. Degrenne\",\"doi\":\"10.1115/1.4053767\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n A reduced weakly-coupled thermo-mechanical model based on the Proper Generalized Decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online post-processing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2022-02-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4053767\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4053767","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A Reduced Model Based On Proper Generalized Decomposition for the Fast Analysis of Igbt Power Modules Lifetime
A reduced weakly-coupled thermo-mechanical model based on the Proper Generalized Decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online post-processing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.