Ziyue Wang, Zixuan Chen, Jianzhuang Xiao, Tao Ding
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引用次数: 0
摘要
本研究提出了一种针对三维打印层间界面和条间界面剪切粘结行为的新型剪切试验方法。随后，研究了不同的再生砂替代率、打印间隔和表面处理的影响。试验结果表明，在相同的打印条件下，层间界面和条间界面的界面剪切强度相近。随着再生砂替代率的增加，界面剪切强度略有下降，而随着打印间隔时间的延长，界面剪切强度急剧下降。与三维打印天然砂浆相比，三维打印再生砂浆的界面具有更高的时间敏感性。考虑到非连续施工会给 3D 打印混凝土构件带来劣质界面，因此应进行有效的表面处理。测试结果表明，表面处理的改善效果依次为环氧浆 > 水泥浆 > 表面润湿 > 无处理。
Experimental Study on Interfacial Shear Behavior of 3D Printed Recycled Mortar.
A novel shear test method on shear bond behavior of 3D printed interlayer interfaces and interstrip interfaces was proposed in this study. Thereafter, the effect of different replacement ratios of recycled sand, printing intervals, and surface treatments were investigated. The test results showed that under the same printing condition, the interfacial shear strengths of interlayer interface and interstrip interface were similar to each other. The interfacial shear strength slightly decreased with the increase of the replacement ratio of recycled sand, while it sharply decreased with the extension of printing interval time. The interfaces in 3D printed recycled mortar had higher time sensitivity compared with 3D printed natural mortar. Considering that discontinuous construction will introduce inferior interfaces in 3D printed concrete components, effective surface treatments should be conducted. According to the test results, the improvement effect of surface treatments was epoxy paste > cement paste > surface wetting > no treatment.
期刊介绍：
3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged.
The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.
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