互连建模和性能分析的机器学习技术

IF 1.8 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jai Narayan Tripathi;Heman Vaghasiya;Dinesh Junjariya;Aksh Chordia
{"title":"互连建模和性能分析的机器学习技术","authors":"Jai Narayan Tripathi;Heman Vaghasiya;Dinesh Junjariya;Aksh Chordia","doi":"10.1109/OJNANO.2021.3133325","DOIUrl":null,"url":null,"abstract":"Interconnects are essential components of any electronic system. Their design, modeling and optimization are becoming complex and computationally expensive with the evolution of semiconductor technology as the devices of nanometer dimensions are being used. In high-speed applications, system level simulations are needed to ensure the robustness of a system in terms of signal and power quality. The simulations are becoming very expensive because of the large dimensional systems and their full-wave models. Machine learning techniques can be used as computationally efficient alternatives in the design cycle of the interconnects. This paper presents a review of the applications of machine learning techniques for design, optimization and analysis of interconnects in high-speed electronic systems. A holistic discussion is presented, including the basics of interconnects, their impact on the system performance, popular machine learning techniques and their applications related to the interconnects. The performance evaluation, optimization and variability analysis of interconnects are discussed in detail. Future scope and overlook that are presented in the literature are also discussed.","PeriodicalId":446,"journal":{"name":"IEEE Open Journal of Nanotechnology","volume":"2 ","pages":"178-190"},"PeriodicalIF":1.8000,"publicationDate":"2021-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782713/9316416/09640578.pdf","citationCount":"2","resultStr":"{\"title\":\"Machine Learning Techniques for Modeling and Performance Analysis of Interconnects\",\"authors\":\"Jai Narayan Tripathi;Heman Vaghasiya;Dinesh Junjariya;Aksh Chordia\",\"doi\":\"10.1109/OJNANO.2021.3133325\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Interconnects are essential components of any electronic system. Their design, modeling and optimization are becoming complex and computationally expensive with the evolution of semiconductor technology as the devices of nanometer dimensions are being used. In high-speed applications, system level simulations are needed to ensure the robustness of a system in terms of signal and power quality. The simulations are becoming very expensive because of the large dimensional systems and their full-wave models. Machine learning techniques can be used as computationally efficient alternatives in the design cycle of the interconnects. This paper presents a review of the applications of machine learning techniques for design, optimization and analysis of interconnects in high-speed electronic systems. A holistic discussion is presented, including the basics of interconnects, their impact on the system performance, popular machine learning techniques and their applications related to the interconnects. The performance evaluation, optimization and variability analysis of interconnects are discussed in detail. Future scope and overlook that are presented in the literature are also discussed.\",\"PeriodicalId\":446,\"journal\":{\"name\":\"IEEE Open Journal of Nanotechnology\",\"volume\":\"2 \",\"pages\":\"178-190\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2021-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/iel7/8782713/9316416/09640578.pdf\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Open Journal of Nanotechnology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/9640578/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Open Journal of Nanotechnology","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/9640578/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 2

摘要

互连是任何电子系统的基本组成部分。随着半导体技术的发展和纳米尺寸器件的使用,它们的设计、建模和优化变得越来越复杂,计算成本也越来越高。在高速应用中,需要系统级仿真来确保系统在信号和电能质量方面的鲁棒性。由于大维度系统和它们的全波模型,模拟变得非常昂贵。机器学习技术可以作为互连设计周期中计算效率高的替代方案。本文综述了机器学习技术在高速电子系统互连设计、优化和分析中的应用。提出了一个全面的讨论,包括互连的基础知识,它们对系统性能的影响,流行的机器学习技术及其与互连相关的应用。详细讨论了互连线的性能评价、优化和变异性分析。未来的范围和忽视,提出了文献也进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Machine Learning Techniques for Modeling and Performance Analysis of Interconnects
Interconnects are essential components of any electronic system. Their design, modeling and optimization are becoming complex and computationally expensive with the evolution of semiconductor technology as the devices of nanometer dimensions are being used. In high-speed applications, system level simulations are needed to ensure the robustness of a system in terms of signal and power quality. The simulations are becoming very expensive because of the large dimensional systems and their full-wave models. Machine learning techniques can be used as computationally efficient alternatives in the design cycle of the interconnects. This paper presents a review of the applications of machine learning techniques for design, optimization and analysis of interconnects in high-speed electronic systems. A holistic discussion is presented, including the basics of interconnects, their impact on the system performance, popular machine learning techniques and their applications related to the interconnects. The performance evaluation, optimization and variability analysis of interconnects are discussed in detail. Future scope and overlook that are presented in the literature are also discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
3.90
自引率
17.60%
发文量
10
审稿时长
12 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信