电沉积NiFe2O4/Cu2O异质结构薄膜,增强光电流产生

IF 3.261
Samba Siva Vadla , Sruthi Guru , Tripta Parida , Subish John , Somnath C. Roy , G. Ranga Rao
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引用次数: 1

摘要

与单相材料相比,异质结构具有优越的水裂解应用。本研究选用Cu2O和NiFe2O4制备薄膜异质结构。Cu2O在60°C下电沉积5分钟,使用三电极系统在ito涂层玻璃基板上。沉积后,用粉末x射线衍射研究证实了相的形成。采用射频溅射法制备了NiFe2O4 (NFO)薄膜,在Cu2O/ITO衬底上室温沉积2h,得到了NFO/Cu2O/ITO ii型异质结构。扫描电镜(SEM)和高分辨率透射电镜(HRTEM)截面图显示,NFO层厚度为120 nm, Cu2O层厚度为1.5µm。Cu2O在ITO上的光电流密度为0.08±0.002 mA/cm2,在Cu2O膜上添加NFO层后,由于ii型异质结的形成,其光电流密度增加到0.12±0.002 mA/cm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Electrodeposited NiFe2O4/Cu2O heterostructure thin films with enhanced photocurrent generation

Electrodeposited NiFe2O4/Cu2O heterostructure thin films with enhanced photocurrent generation

In comparison with single-phase materials, heterostructures have been known for superior water splitting applications. In this study, Cu2O and NiFe2O4 are chosen to fabricate thin film heterostructures. Cu2O is electrodeposited at 60 °C for 5 min on ITO-coated glass substrates using three-electrode system. After deposition, the phase formation is confirmed using powder x-ray diffraction studies. The NiFe2O4 (NFO) thin films are deposited using RF sputtering method at room temperature for 2 h on Cu2O/ITO substrates to obtain NFO/Cu2O/ITO Type-II heterostructure. The scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM) cross-sectional images show that the thickness of NFO layer is 120 nm and Cu2O layer is 1.5 µm. The photocurrent density of Cu2O on ITO is 0.08 ± 0.002 mA/cm2, and it increased to 0.12 ± 0.002 mA/cm2 after adding NFO layer on Cu2O film due to Type-II heterojunction formation.

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