Worker exposure to particulate matter and volatile organic compounds during semiconductor failure analysis: assessment of local exhaust ventilation using field measurements and computational fluid dynamics

Manual wafer cutting during semiconductor failure analysis generates particulate matter (PM), volatile organic compounds (TVOCs), and process odors that may contribute to worker inhalation exposure. This study evaluated PM and TVOC exposure conditions during wafer cutting and examined how a hybrid containment workbench (HCW) modified airflow patterns that may influence contaminant movement toward the worker breathing zone. PM and TVOC measurements were used to characterize exposure conditions during wafer-cutting operations, while airflow measurements, steady-state CFD analysis, qualitative smoke visualization, and worker questionnaires were used to evaluate changes associated with HCW implementation. Airflow characteristics were analyzed using computational fluid dynamics (CFD), quantitatively compared with measured air velocities, and qualitatively evaluated using smoke visualization. Worker questionnaires assessed perceived odor and dust exposure before and after HCW installation. TVOC concentrations observed during patterned-wafer cutting (0.12–0.15 mg/m³) were higher than those observed during bare-wafer cutting (0.02–0.03 mg/m³). CFD-predicted air velocities showed relative errors of 5.3–18.2% compared with the experimentally measured velocities. The HCW produced airflow directed toward the rear exhaust system, and reduced recirculation was observed near the breathing zone. Smoke visualization showed a similar airflow pattern. These findings indicate airflow conditions that may reduce the potential for contaminant movement toward the operator. Before HCW installation, 84.2% of workers (16/19) reported process odor perception, while worker-rated odor and dust control scores improved following HCW implementation. The results indicate that local airflow should be considered together with contaminant concentrations when evaluating worker exposure and local exhaust ventilation in semiconductor failure-analysis laboratories.