Yongqing Wang, Haoyu Li, Huicong Du, Haonan Li, Yuanbin Tang, Lei Yang, Qisheng Zhang, Feng Chen
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Laser-microstructured piezocapacitive system: A wireless platform for quantitative assessment of wound flatness
Postoperative wound management is a critical determinant of recovery in plastic surgery and burn care, where accurate assessment of wound flatness plays a central role. Yet, current evaluation remains largely subjective, relying on clinical experience rather than quantitative metrics. Here, we present a laser-microstructured piezocapacitive system: a compact, fully integrated wireless platform that is encapsulated in soft, biocompatible materials for the high-resolution, real-time monitoring of wound topography. The device incorporates a tetherless, femtosecond-laser-fabricated microstructured sensor that achieves submillimeter resolution (<0.1 mm) and maintains stable performance over 10 000 operation cycles. Wireless interfacing with mobile clients or server networks enables continuous evaluation of sutured wound morphology and healing progression. This platform provides objective, quantitative data on wound flatness and mechanical profiles, offering actionable metrics to guide surgical decision-making and postoperative care. By bridging a critical gap in precision wound management, this technology holds significant potential for improving clinical outcomes and standardizing quality assessment in surgical practice.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS