{"title":"基于热阻的旋转空心圆筒传热模型","authors":"R. Mehryar, S. Momtazi, N. Rezaei","doi":"10.1134/S0869864325020209","DOIUrl":null,"url":null,"abstract":"<div><p>Thermal resistance circuits are widely used to model heat transfer in a stationary solid under steady state conditions in one or two dimensional systems. For a moving solid, the convection mode of heat transfer with the Eulerian/Lagrangian point of view can be considered to model the heat transfer. In this research, heat transfer through a rotating circular cylinder is investigated and modeled using the thermal resistance circuit. Heat enters the cylinder from a constant high temperature boundary at the outer or inner surfaces of the cylinder, respectively. The width of this boundary corresponds to angles 15, 30, 45, 60, 75, or 90 degrees. Heat is exited from the other side of the cylinder on its outer surface at the same angular width as the high temperature boundary. The effect of different parameters such as rotation speed, cylinder thickness and angular width of constant temperature boundaries is investigated. Different models of heat transfer as circumferential conduction, radial conduction, moving fin and semi-infinite are proposed to estimate the rate of heat transfer through the cylinder and a correlation has been proposed for each of them.</p></div>","PeriodicalId":800,"journal":{"name":"Thermophysics and Aeromechanics","volume":"32 2","pages":"485 - 507"},"PeriodicalIF":0.6000,"publicationDate":"2026-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling of heat transfer in rotating hollow cylinders using thermal resistance\",\"authors\":\"R. Mehryar, S. Momtazi, N. Rezaei\",\"doi\":\"10.1134/S0869864325020209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Thermal resistance circuits are widely used to model heat transfer in a stationary solid under steady state conditions in one or two dimensional systems. For a moving solid, the convection mode of heat transfer with the Eulerian/Lagrangian point of view can be considered to model the heat transfer. In this research, heat transfer through a rotating circular cylinder is investigated and modeled using the thermal resistance circuit. Heat enters the cylinder from a constant high temperature boundary at the outer or inner surfaces of the cylinder, respectively. The width of this boundary corresponds to angles 15, 30, 45, 60, 75, or 90 degrees. Heat is exited from the other side of the cylinder on its outer surface at the same angular width as the high temperature boundary. The effect of different parameters such as rotation speed, cylinder thickness and angular width of constant temperature boundaries is investigated. Different models of heat transfer as circumferential conduction, radial conduction, moving fin and semi-infinite are proposed to estimate the rate of heat transfer through the cylinder and a correlation has been proposed for each of them.</p></div>\",\"PeriodicalId\":800,\"journal\":{\"name\":\"Thermophysics and Aeromechanics\",\"volume\":\"32 2\",\"pages\":\"485 - 507\"},\"PeriodicalIF\":0.6000,\"publicationDate\":\"2026-02-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thermophysics and Aeromechanics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1134/S0869864325020209\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, AEROSPACE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermophysics and Aeromechanics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1134/S0869864325020209","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, AEROSPACE","Score":null,"Total":0}
Modeling of heat transfer in rotating hollow cylinders using thermal resistance
Thermal resistance circuits are widely used to model heat transfer in a stationary solid under steady state conditions in one or two dimensional systems. For a moving solid, the convection mode of heat transfer with the Eulerian/Lagrangian point of view can be considered to model the heat transfer. In this research, heat transfer through a rotating circular cylinder is investigated and modeled using the thermal resistance circuit. Heat enters the cylinder from a constant high temperature boundary at the outer or inner surfaces of the cylinder, respectively. The width of this boundary corresponds to angles 15, 30, 45, 60, 75, or 90 degrees. Heat is exited from the other side of the cylinder on its outer surface at the same angular width as the high temperature boundary. The effect of different parameters such as rotation speed, cylinder thickness and angular width of constant temperature boundaries is investigated. Different models of heat transfer as circumferential conduction, radial conduction, moving fin and semi-infinite are proposed to estimate the rate of heat transfer through the cylinder and a correlation has been proposed for each of them.
期刊介绍:
The journal Thermophysics and Aeromechanics publishes original reports, reviews, and discussions on the following topics: hydrogasdynamics, heat and mass transfer, turbulence, means and methods of aero- and thermophysical experiment, physics of low-temperature plasma, and physical and technical problems of energetics. These topics are the prior fields of investigation at the Institute of Thermophysics and the Institute of Theoretical and Applied Mechanics of the Siberian Branch of the Russian Academy of Sciences (SB RAS), which are the founders of the journal along with SB RAS. This publication promotes an exchange of information between the researchers of Russia and the international scientific community.