Plasma sources and plasma-assisted sputtering (PVD, CVD) for thin film deposition in materials for energy conversion and storage

Plasma–assisted physical and chemical vapor deposition (PVD and CVD) have emerged as transformative approaches for engineering thin films with tailored properties for energy conversion and storage applications. Unlike conventional thermal or chemical methods, plasma-based processes enable precise control of film morphology, defect concentration, and stoichiometry at reduced temperatures. This review provides a comprehensive overview of plasma sources and plasma-assisted sputtering techniques, followed by an in-depth examination of their role in fabricating thin films for thermoelectric, hydrogen storage, and electrochemical energy storage devices. Beyond summarizing existing literature, the article highlights the mechanisms through which plasma processes enhance adhesion, nanostructuring, and electrochemical stability. Comparative analyses with non-plasma methods, supported by schematics and performance data, reveal the unique advantages and limitations of plasma-assisted techniques. Recent advancements such as hybrid plasma systems, machine learning–driven optimization, and sustainable plasma sources are also discussed. The paper concludes by outlining critical insights and future research directions that position plasma-assisted deposition as a key enabler of next-generation energy technologies.