Jiulong Zhang , Zuoguang Li , Jingfeng Zhang , Zhiheng Ren , Jinhao Shi , Huan Jin , Jinggang Qin , Chao Zhou , Shaoqing Wei , Zhan Zhang
{"title":"纯扭转模式下卷对卷紫外皮秒激光切割制备的YBCO多丝带载流性能退化研究","authors":"Jiulong Zhang , Zuoguang Li , Jingfeng Zhang , Zhiheng Ren , Jinhao Shi , Huan Jin , Jinggang Qin , Chao Zhou , Shaoqing Wei , Zhan Zhang","doi":"10.1016/j.cryogenics.2025.104213","DOIUrl":null,"url":null,"abstract":"<div><div>YBCO multi-filamentary tapes’ current-carrying performance is susceptible to torsional stress during cable and magnet fabrication. In this study, commercial YBCO tapes from Shanghai Superconductor Technology Co., Ltd. were cut using a reel-to-reel ultraviolet picosecond laser cutting device developed by our group to fabricate 2-filament, 6-filament, and 10-filament multi-filamentary tapes. Additionally, some of the multi-filamentary tapes were encapsulated using the copper-plating re-encapsulation process developed by our group. The current-carrying performance degradation behavior of non-striated tapes, unencapsulated multi-filamentary tapes, and re-encapsulated copper-plated multi-filamentary tapes under pure torsion mode was systematically analyzed. The results show that the degradation behavior of multi-filamentary tapes is strongly dependent on the number of filaments. Specifically, the critical current degradation rates of unencapsulated non-striated tapes and unencapsulated 2-filament tapes are 12.11 % and 12.43 % respectively when the shear strain reaches 0.4125 %. In contrast, unencapsulated 6-filament and unencapsulated 10-filament tapes exhibit degradation rates of 11.69 % and 20.96 % respectively at a lower strain (0.375 %). For samples subjected to single-side copper-plated re-encapsulation with a thickness of 10 μm, the pattern of performance degradation is essentially consistent with that of the samples before copper-plated re-encapsulation, but their overall ability to withstand shear strain is improved by approximately 0.1 %. Macroscopic observations indicate that the surface of the tapes remains smooth without delamination after torsion; however, the “triangular” deformation feature reveals uneven internal stress distribution, suggesting that the superconducting layer may have incurred microscopic damage..</div></div>","PeriodicalId":10812,"journal":{"name":"Cryogenics","volume":"152 ","pages":"Article 104213"},"PeriodicalIF":2.1000,"publicationDate":"2025-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on the degradation of current-carrying performance of YBCO multi-filamentary tapes prepared by reel-to-reel ultraviolet picosecond laser cutting under pure torsion mode\",\"authors\":\"Jiulong Zhang , Zuoguang Li , Jingfeng Zhang , Zhiheng Ren , Jinhao Shi , Huan Jin , Jinggang Qin , Chao Zhou , Shaoqing Wei , Zhan Zhang\",\"doi\":\"10.1016/j.cryogenics.2025.104213\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>YBCO multi-filamentary tapes’ current-carrying performance is susceptible to torsional stress during cable and magnet fabrication. In this study, commercial YBCO tapes from Shanghai Superconductor Technology Co., Ltd. were cut using a reel-to-reel ultraviolet picosecond laser cutting device developed by our group to fabricate 2-filament, 6-filament, and 10-filament multi-filamentary tapes. Additionally, some of the multi-filamentary tapes were encapsulated using the copper-plating re-encapsulation process developed by our group. The current-carrying performance degradation behavior of non-striated tapes, unencapsulated multi-filamentary tapes, and re-encapsulated copper-plated multi-filamentary tapes under pure torsion mode was systematically analyzed. The results show that the degradation behavior of multi-filamentary tapes is strongly dependent on the number of filaments. Specifically, the critical current degradation rates of unencapsulated non-striated tapes and unencapsulated 2-filament tapes are 12.11 % and 12.43 % respectively when the shear strain reaches 0.4125 %. In contrast, unencapsulated 6-filament and unencapsulated 10-filament tapes exhibit degradation rates of 11.69 % and 20.96 % respectively at a lower strain (0.375 %). For samples subjected to single-side copper-plated re-encapsulation with a thickness of 10 μm, the pattern of performance degradation is essentially consistent with that of the samples before copper-plated re-encapsulation, but their overall ability to withstand shear strain is improved by approximately 0.1 %. Macroscopic observations indicate that the surface of the tapes remains smooth without delamination after torsion; however, the “triangular” deformation feature reveals uneven internal stress distribution, suggesting that the superconducting layer may have incurred microscopic damage..</div></div>\",\"PeriodicalId\":10812,\"journal\":{\"name\":\"Cryogenics\",\"volume\":\"152 \",\"pages\":\"Article 104213\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2025-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Cryogenics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0011227525001924\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"PHYSICS, APPLIED\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Cryogenics","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0011227525001924","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
Study on the degradation of current-carrying performance of YBCO multi-filamentary tapes prepared by reel-to-reel ultraviolet picosecond laser cutting under pure torsion mode
YBCO multi-filamentary tapes’ current-carrying performance is susceptible to torsional stress during cable and magnet fabrication. In this study, commercial YBCO tapes from Shanghai Superconductor Technology Co., Ltd. were cut using a reel-to-reel ultraviolet picosecond laser cutting device developed by our group to fabricate 2-filament, 6-filament, and 10-filament multi-filamentary tapes. Additionally, some of the multi-filamentary tapes were encapsulated using the copper-plating re-encapsulation process developed by our group. The current-carrying performance degradation behavior of non-striated tapes, unencapsulated multi-filamentary tapes, and re-encapsulated copper-plated multi-filamentary tapes under pure torsion mode was systematically analyzed. The results show that the degradation behavior of multi-filamentary tapes is strongly dependent on the number of filaments. Specifically, the critical current degradation rates of unencapsulated non-striated tapes and unencapsulated 2-filament tapes are 12.11 % and 12.43 % respectively when the shear strain reaches 0.4125 %. In contrast, unencapsulated 6-filament and unencapsulated 10-filament tapes exhibit degradation rates of 11.69 % and 20.96 % respectively at a lower strain (0.375 %). For samples subjected to single-side copper-plated re-encapsulation with a thickness of 10 μm, the pattern of performance degradation is essentially consistent with that of the samples before copper-plated re-encapsulation, but their overall ability to withstand shear strain is improved by approximately 0.1 %. Macroscopic observations indicate that the surface of the tapes remains smooth without delamination after torsion; however, the “triangular” deformation feature reveals uneven internal stress distribution, suggesting that the superconducting layer may have incurred microscopic damage..
期刊介绍:
Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are:
- Applications of superconductivity: magnets, electronics, devices
- Superconductors and their properties
- Properties of materials: metals, alloys, composites, polymers, insulations
- New applications of cryogenic technology to processes, devices, machinery
- Refrigeration and liquefaction technology
- Thermodynamics
- Fluid properties and fluid mechanics
- Heat transfer
- Thermometry and measurement science
- Cryogenics in medicine
- Cryoelectronics