热敏性聚（苯乙烯-嵌段-乙烯-丁烯-嵌段-苯乙烯）/聚（甲基丙烯酸丁酯-甲基丙烯酸异丁酯）共混物及其在4D打印中的应用

IF 4.9 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2025-10-15 DOI:10.1016/j.sna.2025.117176

Emre Tekay , Betül Aybakan , Vahap Uygar Aslan

{"title":"热敏性聚（苯乙烯-嵌段-乙烯-丁烯-嵌段-苯乙烯）/聚（甲基丙烯酸丁酯-甲基丙烯酸异丁酯）共混物及其在4D打印中的应用","authors":"Emre Tekay , Betül Aybakan , Vahap Uygar Aslan","doi":"10.1016/j.sna.2025.117176","DOIUrl":null,"url":null,"abstract":"<div><div>Recent advancements in additive manufacturing technology have also introduced new research areas in materials science. The processing of shape memory polymers (SMPs) using 3D printers has led to the emergence of 4D printing technology. The present study focused on the creation of new polymer blends that incorporate maleic anhydride grafted SEBS (SEBS-g-MA) alongside poly(butyl methacrylate-co-isobutyl methacrylate) (poly(BM-co-iBM)) in diverse compositions, aimed at facilitating advancements in 4D printing technologies. In the formulation with a weight ratio of SEBS-g-MA to poly(BM-co-iBM) of 6/4 (60S-40B), a co-continuous morphology was detected. With a rising concentration of SEBS-g-MA in the polymer blends, the T<sub>g</sub> of the poly(BM-co-iBM) phase exhibited an upward shift. Dynamic mechanical analysis results indicate that the poly(BM-co-iBM) polymer within the blends transitioned from a glassy state to a rubbery state before reaching 55°C, which resulted in a pronounced reduction in the storage modulus at this temperature. On the other hand, with an increase in the amount of poly(BM-co-iBM) in the blend, there was a corresponding increase in the elastic modulus values, while the elongation at break values diminished. The results from the thermo-responsive shape memory analysis demonstrated that the 60S-40B blend provided the most favorable performance. A filament suitable for 4D printing was developed from this blend for application in fused deposition modeling printers. Employing the filament, objects produced via 4D printing were developed for applications such as lifting devices, stents, door closers, cogwheels, and robotic grippers, and their shape memory properties were evaluated.</div></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"396 ","pages":"Article 117176"},"PeriodicalIF":4.9000,"publicationDate":"2025-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Heat-responsive poly(styrene-block-ethylene-butylene-block-styrene)/poly(butyl methacrylate-co-isobutyl methacrylate) blends and their applications in 4D printing\",\"authors\":\"Emre Tekay , Betül Aybakan , Vahap Uygar Aslan\",\"doi\":\"10.1016/j.sna.2025.117176\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Recent advancements in additive manufacturing technology have also introduced new research areas in materials science. The processing of shape memory polymers (SMPs) using 3D printers has led to the emergence of 4D printing technology. The present study focused on the creation of new polymer blends that incorporate maleic anhydride grafted SEBS (SEBS-g-MA) alongside poly(butyl methacrylate-co-isobutyl methacrylate) (poly(BM-co-iBM)) in diverse compositions, aimed at facilitating advancements in 4D printing technologies. In the formulation with a weight ratio of SEBS-g-MA to poly(BM-co-iBM) of 6/4 (60S-40B), a co-continuous morphology was detected. With a rising concentration of SEBS-g-MA in the polymer blends, the T<sub>g</sub> of the poly(BM-co-iBM) phase exhibited an upward shift. Dynamic mechanical analysis results indicate that the poly(BM-co-iBM) polymer within the blends transitioned from a glassy state to a rubbery state before reaching 55°C, which resulted in a pronounced reduction in the storage modulus at this temperature. On the other hand, with an increase in the amount of poly(BM-co-iBM) in the blend, there was a corresponding increase in the elastic modulus values, while the elongation at break values diminished. The results from the thermo-responsive shape memory analysis demonstrated that the 60S-40B blend provided the most favorable performance. A filament suitable for 4D printing was developed from this blend for application in fused deposition modeling printers. Employing the filament, objects produced via 4D printing were developed for applications such as lifting devices, stents, door closers, cogwheels, and robotic grippers, and their shape memory properties were evaluated.</div></div>\",\"PeriodicalId\":21689,\"journal\":{\"name\":\"Sensors and Actuators A-physical\",\"volume\":\"396 \",\"pages\":\"Article 117176\"},\"PeriodicalIF\":4.9000,\"publicationDate\":\"2025-10-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensors and Actuators A-physical\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0924424725009823\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424725009823","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

增材制造技术的最新进展也为材料科学引入了新的研究领域。使用3D打印机加工形状记忆聚合物（SMPs）导致了4D打印技术的出现。目前的研究重点是创建新的聚合物共混物，将马来酸酐接枝SEBS （SEBS-g- ma）与不同成分的聚（甲基丙烯酸丁酯-共甲基丙烯酸异丁酯）（聚（BM-co-iBM））结合在一起，旨在促进4D打印技术的进步。在SEBS-g-MA与聚（BM-co-iBM）质量比为6/4 （60S-40B）的配方中，检测到共连续形貌。随着共混物中SEBS-g-MA浓度的升高，聚（BM-co-iBM）相的Tg呈上升趋势。动态力学分析结果表明，共混物中的聚（BM-co-iBM）聚合物在达到55℃之前从玻璃态转变为橡胶态，导致该温度下的存储模量显著降低。另一方面，随着共混物中聚（BM-co-iBM）含量的增加，其弹性模量相应增加，断裂伸长率降低。热响应形状记忆分析结果表明，60S-40B共混物具有较好的性能。从这种混合物中开发出适合4D打印的长丝，用于熔融沉积建模打印机。利用这种材料，通过4D打印生产的物体被开发用于起重装置、支架、闭门器、齿轮和机器人抓取器等应用，并评估了它们的形状记忆特性。

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Heat-responsive poly(styrene-block-ethylene-butylene-block-styrene)/poly(butyl methacrylate-co-isobutyl methacrylate) blends and their applications in 4D printing

Recent advancements in additive manufacturing technology have also introduced new research areas in materials science. The processing of shape memory polymers (SMPs) using 3D printers has led to the emergence of 4D printing technology. The present study focused on the creation of new polymer blends that incorporate maleic anhydride grafted SEBS (SEBS-g-MA) alongside poly(butyl methacrylate-co-isobutyl methacrylate) (poly(BM-co-iBM)) in diverse compositions, aimed at facilitating advancements in 4D printing technologies. In the formulation with a weight ratio of SEBS-g-MA to poly(BM-co-iBM) of 6/4 (60S-40B), a co-continuous morphology was detected. With a rising concentration of SEBS-g-MA in the polymer blends, the T_g of the poly(BM-co-iBM) phase exhibited an upward shift. Dynamic mechanical analysis results indicate that the poly(BM-co-iBM) polymer within the blends transitioned from a glassy state to a rubbery state before reaching 55°C, which resulted in a pronounced reduction in the storage modulus at this temperature. On the other hand, with an increase in the amount of poly(BM-co-iBM) in the blend, there was a corresponding increase in the elastic modulus values, while the elongation at break values diminished. The results from the thermo-responsive shape memory analysis demonstrated that the 60S-40B blend provided the most favorable performance. A filament suitable for 4D printing was developed from this blend for application in fused deposition modeling printers. Employing the filament, objects produced via 4D printing were developed for applications such as lifting devices, stents, door closers, cogwheels, and robotic grippers, and their shape memory properties were evaluated.

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...