{"title":"基于MGL模型的变导热系数和非理想界面条件下双层结构的热弹性响应","authors":"Xiaoya Li, Zixin Wang, Bo Ning","doi":"10.1016/j.apm.2025.116507","DOIUrl":null,"url":null,"abstract":"<div><div>To investigate the influence of strain rate on the elastic and thermal wave, this work analyzes the thermo-elastic responses of bi-layered structure in the context of the modified Green Lindsay (MGL) model. The temperature dependent thermal conductivity and the non-ideal interfacial condition are considered. The nonlinear governing equations of bi-layered structure are solved by Kirchhoff and Laplace transformation. The influences of variable thermal conductivity, thermal contact resistant, mechanical impedance, and the material parameters ratio on the distributions of temperature, displacement and stress are discussed and illustrated graphically. This study can provide some theoretical foundation and technical guidance for the optimized thermal design of the structure.</div></div>","PeriodicalId":50980,"journal":{"name":"Applied Mathematical Modelling","volume":"151 ","pages":"Article 116507"},"PeriodicalIF":4.4000,"publicationDate":"2025-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The thermo-elastic responses of bi-layered structure with the variable thermal conductivity and the non-ideal interfacial condition based on MGL model\",\"authors\":\"Xiaoya Li, Zixin Wang, Bo Ning\",\"doi\":\"10.1016/j.apm.2025.116507\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>To investigate the influence of strain rate on the elastic and thermal wave, this work analyzes the thermo-elastic responses of bi-layered structure in the context of the modified Green Lindsay (MGL) model. The temperature dependent thermal conductivity and the non-ideal interfacial condition are considered. The nonlinear governing equations of bi-layered structure are solved by Kirchhoff and Laplace transformation. The influences of variable thermal conductivity, thermal contact resistant, mechanical impedance, and the material parameters ratio on the distributions of temperature, displacement and stress are discussed and illustrated graphically. This study can provide some theoretical foundation and technical guidance for the optimized thermal design of the structure.</div></div>\",\"PeriodicalId\":50980,\"journal\":{\"name\":\"Applied Mathematical Modelling\",\"volume\":\"151 \",\"pages\":\"Article 116507\"},\"PeriodicalIF\":4.4000,\"publicationDate\":\"2025-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Mathematical Modelling\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0307904X25005815\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Mathematical Modelling","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0307904X25005815","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
The thermo-elastic responses of bi-layered structure with the variable thermal conductivity and the non-ideal interfacial condition based on MGL model
To investigate the influence of strain rate on the elastic and thermal wave, this work analyzes the thermo-elastic responses of bi-layered structure in the context of the modified Green Lindsay (MGL) model. The temperature dependent thermal conductivity and the non-ideal interfacial condition are considered. The nonlinear governing equations of bi-layered structure are solved by Kirchhoff and Laplace transformation. The influences of variable thermal conductivity, thermal contact resistant, mechanical impedance, and the material parameters ratio on the distributions of temperature, displacement and stress are discussed and illustrated graphically. This study can provide some theoretical foundation and technical guidance for the optimized thermal design of the structure.
期刊介绍:
Applied Mathematical Modelling focuses on research related to the mathematical modelling of engineering and environmental processes, manufacturing, and industrial systems. A significant emerging area of research activity involves multiphysics processes, and contributions in this area are particularly encouraged.
This influential publication covers a wide spectrum of subjects including heat transfer, fluid mechanics, CFD, and transport phenomena; solid mechanics and mechanics of metals; electromagnets and MHD; reliability modelling and system optimization; finite volume, finite element, and boundary element procedures; modelling of inventory, industrial, manufacturing and logistics systems for viable decision making; civil engineering systems and structures; mineral and energy resources; relevant software engineering issues associated with CAD and CAE; and materials and metallurgical engineering.
Applied Mathematical Modelling is primarily interested in papers developing increased insights into real-world problems through novel mathematical modelling, novel applications or a combination of these. Papers employing existing numerical techniques must demonstrate sufficient novelty in the solution of practical problems. Papers on fuzzy logic in decision-making or purely financial mathematics are normally not considered. Research on fractional differential equations, bifurcation, and numerical methods needs to include practical examples. Population dynamics must solve realistic scenarios. Papers in the area of logistics and business modelling should demonstrate meaningful managerial insight. Submissions with no real-world application will not be considered.