Thermodynamic performance of a new composite honeycomb structure heat sink based on multi-objective co-optimization

The optimal design of the heat sink is the key to improve the safe and stable operation of the insulated gate bipolar transistor. In this paper, the traditional hexagonal honeycomb structure is broken through, and three new structures, pentagon, heptagon and octagon are introduced. First, the heat transfer and flow behavior of the four structures are studied at the same inlet velocity, and the thermal irreversibility is analyzed. It is found that the seven-sided structure has the best heat dissipation performance. Compared with the hexagonal honeycomb structure, the maximum temperature of the chip is reduced by 1.98 K; the pressure drop is increased by 17 % and the hydraulic thermal performance coefficient is increased by 12 %. To optimize the flow performance of the heptagonal structure, the optimal structure is obtained by mixing the heptagonal unit with the low thermal resistance hexagon. Second, the heat dissipation performance of the optimal structure is systematically analyzed at different inlet velocities. The results show that the higher heptagonal proportional nusselt number can be effectively improved, while placing it away from the inlet and the main channel reduces the pressure drop and total entropy loss. Finally, 0.4 m/s is determined as the optimal inlet velocity. At this time, the maximum temperature of the chip is slightly reduced, and the hydraulic thermal performance coefficient is increased by 9.4 %.