阴极电弧蒸发生长含硅ta-C薄膜的结构和摩擦力学性能

IF 6.1 2区 材料科学 Q1 MATERIALS SCIENCE, COATINGS & FILMS
Nelson Filipe Lopes Dias , Dominic Stangier , Julia Urbanczyk , Gabriel Brune , Jörg Debus , Wolfgang Tillmann
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引用次数: 0

摘要

在四面体非晶碳(ta-C)薄膜中掺入硅(Si)是改善其性能和扩大其应用领域的有效策略。然而,一个关键的挑战在于在不显著影响硬度的情况下实现低硅浓度的可控掺入。为了解决这个问题,石墨复合阴极与2.5和5 at。在垂直排列的阴极电弧蒸发器阵列中,采用-% Si和纯石墨作为阴极。这种结构使ta-C:Si薄膜能够在Si含量为0.1 ~ 6.6 at.-%的AISI M2钢衬底上沉积。随着Si含量的增加,ta-C:Si薄膜的硬度逐渐降低,即使在Si浓度最高的情况下,ta-C:Si薄膜的硬度在H≈45 GPa时仍保持较高的硬度。当Si含量低于1 at.-%时,可获得H≈70 GPa的高硬度。硬度的降低是由于拉曼光谱显示的非晶态网络的结构变化,随着Si浓度的升高,sp2分数增加,从孤立的烯烃sp2位转变为更有序的类芳烃构型。摩擦学测试表明,与低Si含量的薄膜相比,高Si含量的ta-C:Si表现出更短的磨合相和更低的磨损。另外,Si浓度至少为5at。-%确保稳定的低摩擦系数μ <; 0.2在延长的滑动距离。这些发现强调了仔细控制Si含量对调整ta-C:Si薄膜摩擦力学性能的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Structure and tribo-mechanical properties of Si-containing ta-C thin films grown by cathodic arc evaporation

Structure and tribo-mechanical properties of Si-containing ta-C thin films grown by cathodic arc evaporation
The incorporation of silicon (Si) into tetrahedral amorphous carbon (ta-C) thin films is an effective strategy for improving the properties and expanding their application field. However, a key challenge lies in achieving controlled incorporation of low Si concentrations without significantly compromising hardness. To address this, graphite compound cathodes with 2.5 and 5 at.-% Si, as well as pure graphite, were employed as cathodes in a vertically arranged array of cathodic arc evaporators. This configuration enabled the deposition of ta-C:Si thin films on AISI M2 steel substrates with Si contents ranging from 0.1 to 6.6 at.-%.
The hardness of the ta-C:Si films decreases with increasing Si content, yet remains high at H ≈ 45 GPa even at the highest Si concentration. A high hardness of H ≈ 70 GPa is achieved at the lowest Si contents below 1 at.-%. The reduction in hardness is attributed to structural changes in the amorphous network revealed by Raman spectroscopy, which shows both an increased sp2 fraction and a transformation from isolated olefinic sp2 sites to more ordered aromatic-like configurations with rising Si concentration. Tribological tests reveal that high Si-containing ta-C:Si exhibits a shorter run-in phase and reduced wear of the steel counterpart compared to thin films with lower Si content. Additionally, a Si concentration of at least 5 at.-% ensures stable low coefficients of friction with μ < 0.2 over extended sliding distances. These findings highlight the importance of carefully control the Si content to adjust the tribo-mechanical performance of ta-C:Si thin films.
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来源期刊
Surface & Coatings Technology
Surface & Coatings Technology 工程技术-材料科学:膜
CiteScore
10.00
自引率
11.10%
发文量
921
审稿时长
19 days
期刊介绍: Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance: A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.
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