Qingsong Bian , Jun Liao , Shijian Fa , Weiming Liu , Hongbo Pan , Fabin Cao
{"title":"不锈钢板电解表面粗化对不锈钢/铝复合板冷轧接界面结合强度影响的研究","authors":"Qingsong Bian , Jun Liao , Shijian Fa , Weiming Liu , Hongbo Pan , Fabin Cao","doi":"10.1016/j.surfcoat.2025.132703","DOIUrl":null,"url":null,"abstract":"<div><div>Traditional mechanical polishing, widely used for preparing stainless steel (SS)/aluminum clad plates, has long been plagued by uneven coarsening effect and inadequate interfacial adhesion, thereby failing to meet the demands of modern industrial development for high-performance SS/Al clad plates. To address this, electrolytic surface roughening was used as a substitute for conventional brush roughening in the pretreatment of stainless steel. The SS samples treated by electrolytic surface treatment were bonded to aluminum alloy through cold rolling under various cold rolling and annealing conditions. Stripping experiments, hardness testing, and microanalysis techniques were employed to investigate the characteristics of the interface traits of different samples. Results showed that electrolytic treatment combined with rolling preheating induced the formation of a brittle Face-hardened and carbon diffusion layer on the SS surface. The bond strength of the specimens initially increases and then decrease with increasing reduction ratio, peaking at a 20 % reduction. This trend was attributed to the combined effects of work hardening from rolling deformation and the embedding/fragmentation of brittle carbides into the aluminum alloy surface. Increasing the annealing temperature and time causes the bonding strength to firstly increase and then decrease, which is related to the combined effects of enhanced atomic interdiffusion and the formation of an intermetallic compound (IMC) layer. The optimal processing technique for SS/ Al clad plates produced by cold rolling is annealing at 500 °C for 2 h, followed by a single cold rolling pass with 20 % reduction. This process yields a bonding peel strength of up to 225 N/mm at the clad plate interface, which is 5 to 6 times higher values reported for SS/Al clad plates to date. Microstructural analysis confirms a dense, well-bonded interface with minimal cracks or fractures. Furthermore, the fracture surface exhibits abundant dimples of varying sizes, accompanied by only sparse IMC formation, further confirming the superior interfacial integrity of the optimized clad plates.</div></div>","PeriodicalId":22009,"journal":{"name":"Surface & Coatings Technology","volume":"516 ","pages":"Article 132703"},"PeriodicalIF":6.1000,"publicationDate":"2025-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on the effect of electrolytic surface roughening of a stainless steel plate on the interfacial bonding strength of the stainless steel/aluminum clad plates by the cold roll bonding\",\"authors\":\"Qingsong Bian , Jun Liao , Shijian Fa , Weiming Liu , Hongbo Pan , Fabin Cao\",\"doi\":\"10.1016/j.surfcoat.2025.132703\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Traditional mechanical polishing, widely used for preparing stainless steel (SS)/aluminum clad plates, has long been plagued by uneven coarsening effect and inadequate interfacial adhesion, thereby failing to meet the demands of modern industrial development for high-performance SS/Al clad plates. To address this, electrolytic surface roughening was used as a substitute for conventional brush roughening in the pretreatment of stainless steel. The SS samples treated by electrolytic surface treatment were bonded to aluminum alloy through cold rolling under various cold rolling and annealing conditions. Stripping experiments, hardness testing, and microanalysis techniques were employed to investigate the characteristics of the interface traits of different samples. Results showed that electrolytic treatment combined with rolling preheating induced the formation of a brittle Face-hardened and carbon diffusion layer on the SS surface. The bond strength of the specimens initially increases and then decrease with increasing reduction ratio, peaking at a 20 % reduction. This trend was attributed to the combined effects of work hardening from rolling deformation and the embedding/fragmentation of brittle carbides into the aluminum alloy surface. Increasing the annealing temperature and time causes the bonding strength to firstly increase and then decrease, which is related to the combined effects of enhanced atomic interdiffusion and the formation of an intermetallic compound (IMC) layer. The optimal processing technique for SS/ Al clad plates produced by cold rolling is annealing at 500 °C for 2 h, followed by a single cold rolling pass with 20 % reduction. This process yields a bonding peel strength of up to 225 N/mm at the clad plate interface, which is 5 to 6 times higher values reported for SS/Al clad plates to date. Microstructural analysis confirms a dense, well-bonded interface with minimal cracks or fractures. Furthermore, the fracture surface exhibits abundant dimples of varying sizes, accompanied by only sparse IMC formation, further confirming the superior interfacial integrity of the optimized clad plates.</div></div>\",\"PeriodicalId\":22009,\"journal\":{\"name\":\"Surface & Coatings Technology\",\"volume\":\"516 \",\"pages\":\"Article 132703\"},\"PeriodicalIF\":6.1000,\"publicationDate\":\"2025-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface & Coatings Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0257897225009776\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface & Coatings Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0257897225009776","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
Study on the effect of electrolytic surface roughening of a stainless steel plate on the interfacial bonding strength of the stainless steel/aluminum clad plates by the cold roll bonding
Traditional mechanical polishing, widely used for preparing stainless steel (SS)/aluminum clad plates, has long been plagued by uneven coarsening effect and inadequate interfacial adhesion, thereby failing to meet the demands of modern industrial development for high-performance SS/Al clad plates. To address this, electrolytic surface roughening was used as a substitute for conventional brush roughening in the pretreatment of stainless steel. The SS samples treated by electrolytic surface treatment were bonded to aluminum alloy through cold rolling under various cold rolling and annealing conditions. Stripping experiments, hardness testing, and microanalysis techniques were employed to investigate the characteristics of the interface traits of different samples. Results showed that electrolytic treatment combined with rolling preheating induced the formation of a brittle Face-hardened and carbon diffusion layer on the SS surface. The bond strength of the specimens initially increases and then decrease with increasing reduction ratio, peaking at a 20 % reduction. This trend was attributed to the combined effects of work hardening from rolling deformation and the embedding/fragmentation of brittle carbides into the aluminum alloy surface. Increasing the annealing temperature and time causes the bonding strength to firstly increase and then decrease, which is related to the combined effects of enhanced atomic interdiffusion and the formation of an intermetallic compound (IMC) layer. The optimal processing technique for SS/ Al clad plates produced by cold rolling is annealing at 500 °C for 2 h, followed by a single cold rolling pass with 20 % reduction. This process yields a bonding peel strength of up to 225 N/mm at the clad plate interface, which is 5 to 6 times higher values reported for SS/Al clad plates to date. Microstructural analysis confirms a dense, well-bonded interface with minimal cracks or fractures. Furthermore, the fracture surface exhibits abundant dimples of varying sizes, accompanied by only sparse IMC formation, further confirming the superior interfacial integrity of the optimized clad plates.
期刊介绍:
Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance:
A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting.
B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.