The interface behavior of an electrode imperfectly bonded to a thermoelectric substrate

This paper examines the interfacial behavior of an electrode imperfectly bonded to a thermoelectric substrate, either with or without an adhesive interlayer. The governing integro-differential equations for the interface problem under consideration are formulated based on the equilibrium and deformation compatibility conditions. The integral equations are solved by utilizing the Gauss-Chebyshev discretization method. The effects of the debonding length, the debonding position, the thermoelectric load, the geometry, and the shear modulus of the electrode and the adhesive interlayer on the interfacial response are comprehensively studied. The singularities of the current density, the energy flux, and the shear stress at the debonding edges are analyzed in detail. It is found that a more reliable interface can be achieved if the electrode has a lower modulus. A thicker adhesive interlayer is demonstrated to effectively mitigate interfacial stress concentration. The results provide important references for the design of electrode-thermoelectric substrate systems in advanced flexible and stretchable thermoelectric devices.