Xiaoxiao Wang , Dong Zheng , Ruiting Shi , Sheng’an Yang , Di Wang , Men Shao
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Research on improved preparation process of a traditional adhesive for inlaid porcelain
This paper focuses on the adhesives materials used in traditional ceramic inlay architectural decorations. Without altering the conventional raw materials, scientific experimental methods were employed to analyze and optimize the preparation process. The results demonstrate that adjusting the mass ratio of raw materials enhances the bonding strength of the adhesives. Material phase analysis revealed a relatively stable adhesives structure, while environmental simulation tests evaluated the aging degree and physical performance of the adhesives. The process optimization of traditional ceramic inlay adhesives significantly improves their bonding strength and application performance, offering new breakthroughs for the preservation and restoration of ceramic inlay heritage.
期刊介绍:
in Shams Engineering Journal is an international journal devoted to publication of peer reviewed original high-quality research papers and review papers in both traditional topics and those of emerging science and technology. Areas of both theoretical and fundamental interest as well as those concerning industrial applications, emerging instrumental techniques and those which have some practical application to an aspect of human endeavor, such as the preservation of the environment, health, waste disposal are welcome. The overall focus is on original and rigorous scientific research results which have generic significance.
Ain Shams Engineering Journal focuses upon aspects of mechanical engineering, electrical engineering, civil engineering, chemical engineering, petroleum engineering, environmental engineering, architectural and urban planning engineering. Papers in which knowledge from other disciplines is integrated with engineering are especially welcome like nanotechnology, material sciences, and computational methods as well as applied basic sciences: engineering mathematics, physics and chemistry.