无涂层微尺度激光冲击强化对slm加工GH3625的激光烧蚀机理及参数影响

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-10-02 DOI:10.1016/j.matlet.2025.139605

Peiwen Xu , Li Yan , Xiangfan Nie , Fayong Zhong , Shixi Li , Hongbing Li

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引用次数: 0

摘要

选择性激光熔化（SLM）为复杂金属部件的制造提供了巨大的潜力。然而，较差的表面完整性限制了它们的实际应用，特别是在加工不可行的区域。本文创新性地采用微尺度无涂层激光冲击强化技术（μLSPwC）来提高激光激光加工组件的表面完整性。研究了激光烧蚀机理和参数效应。结果表明：μLSPwC有效地消除了表面缺陷，缺陷密度从13.25%降至0.49%，表面粗糙度从7.75 μm降至6.05 μm；在淬硬层扩展至270 μm的同时，引入深度为460 μm的压缩残余应力层（CRS），表面显微硬度提高39.4%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Laser ablation mechanism and parameter effects of SLM-fabricated GH3625 treated by microscale laser shock peening without coating

查看原文本刊更多论文

Laser ablation mechanism and parameter effects of SLM-fabricated GH3625 treated by microscale laser shock peening without coating

Selective laser melting (SLM) offers great potential for fabricating complex metallic components. However, poor surface integrity limits their practical applications, especially in regions where machining is infeasible. In this work, microscale laser shock peening without coating (μLSPwC) is innovatively applied to improve the surface integrity of SLM-fabricated components. The laser ablation mechanism and parameter effects were investigated. The results indicated that μLSPwC effectively eliminated surface defects, lowering the defect density from 13.25 % to 0.49 % and the surface roughness from 7.75 μm to 6.05 μm. Furthermore, a compressive residual stress (CRS) layer with a depth of 460 μm was introduced, while the hardened layer extended to 270 μm, with the surface microhardness increasing by 39.4 %.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive