{"title":"铸态Ti-5Cu合金中Cu偏析的研究","authors":"Jin-Tao Zou , Yong-Dong He , Xu Yue","doi":"10.1016/j.matlet.2025.139468","DOIUrl":null,"url":null,"abstract":"<div><div>To investigate the compositional segregation behavior of Cu during the solidification of Ti-5Cu alloy and its influence on microstructural evolution under thermal deformation, this study employed ICP-OES and SEM-EDS techniques to analyze the compositional distribution in the initial, intermediate, and final solidification zones of the as-cast ingot. The macro- and micro-scale distribution characteristics of Cu were revealed. Results show that Cu segregation occurs in the ingot, with significant enrichment along grain boundaries. In addition, the Ti<sub>2</sub>Cu precipitates are dispersed along grain boundaries, effectively hindering grain growth. These findings provide critical theoretical guidance for optimizing homogenization treatments and hot-working parameters of Ti-Cu alloy ingots.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"404 ","pages":"Article 139468"},"PeriodicalIF":2.7000,"publicationDate":"2025-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation of Cu segregation in cast Ti-5Cu alloys\",\"authors\":\"Jin-Tao Zou , Yong-Dong He , Xu Yue\",\"doi\":\"10.1016/j.matlet.2025.139468\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>To investigate the compositional segregation behavior of Cu during the solidification of Ti-5Cu alloy and its influence on microstructural evolution under thermal deformation, this study employed ICP-OES and SEM-EDS techniques to analyze the compositional distribution in the initial, intermediate, and final solidification zones of the as-cast ingot. The macro- and micro-scale distribution characteristics of Cu were revealed. Results show that Cu segregation occurs in the ingot, with significant enrichment along grain boundaries. In addition, the Ti<sub>2</sub>Cu precipitates are dispersed along grain boundaries, effectively hindering grain growth. These findings provide critical theoretical guidance for optimizing homogenization treatments and hot-working parameters of Ti-Cu alloy ingots.</div></div>\",\"PeriodicalId\":384,\"journal\":{\"name\":\"Materials Letters\",\"volume\":\"404 \",\"pages\":\"Article 139468\"},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2025-09-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167577X25014983\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X25014983","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Investigation of Cu segregation in cast Ti-5Cu alloys
To investigate the compositional segregation behavior of Cu during the solidification of Ti-5Cu alloy and its influence on microstructural evolution under thermal deformation, this study employed ICP-OES and SEM-EDS techniques to analyze the compositional distribution in the initial, intermediate, and final solidification zones of the as-cast ingot. The macro- and micro-scale distribution characteristics of Cu were revealed. Results show that Cu segregation occurs in the ingot, with significant enrichment along grain boundaries. In addition, the Ti2Cu precipitates are dispersed along grain boundaries, effectively hindering grain growth. These findings provide critical theoretical guidance for optimizing homogenization treatments and hot-working parameters of Ti-Cu alloy ingots.
期刊介绍:
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive