Guichuan Li , Michel Smet , Yagnitha Kandula , Zhuangzhuang Liu , Brecht Van Hooreweder , Kim Vanmeensel
{"title":"通过纳米Mo颗粒修饰实现铜合金的激光粉末床熔合","authors":"Guichuan Li , Michel Smet , Yagnitha Kandula , Zhuangzhuang Liu , Brecht Van Hooreweder , Kim Vanmeensel","doi":"10.1016/j.addma.2025.104988","DOIUrl":null,"url":null,"abstract":"<div><div>Laser Powder Bed Fusion (PBF-LB) of copper and low-alloyed copper alloys remains challenging due to their low infrared absorptivity and high thermal conductivity. This study introduces a multi-faceted strategy integrating computational thermodynamics-guided alloy design, Mo nanoparticle surface decoration, and thermal process optimization to enable robust and energy-efficient PBF-LB processing of reflective Cu-based alloys. Surface decoration with 0.44 wt% Mo nanoparticles enhances laser energy absorption, enabling a 40–45 % reduction in the required laser volumetric energy density from 167 to 188–100–118 J/mm<sup>3</sup> to achieve > 99.1 % part density. Additionally, Mo addition improves the alloy’s resistance to precipitate coarsening while maintaining low solid solubility in Cu, thereby preserving electrical conductivity. In CuCrZr alloys, baseplate preheating to 300 °C promotes densification and in-situ precipitation of Cr and Cu<sub>x</sub>Zr<sub>y</sub> phases during PBF-LB, enhancing both strength and conductivity. In contrast, Mo addition suppresses in-situ precipitation due to its sluggish diffusion in Cu and preferential partitioning into Cr and Cu<sub>x</sub>Zr<sub>y</sub> phases. After direct age-hardening (450 °C, 9 h), the CuCrZrMo alloy exhibits a fine dispersion of Mo-doped nanoprecipitates, achieving a yield strength of 598 ± 7 MPa (vs. 576 ± 7 MPa for CuCrZr) while retaining high electrical conductivity (67–68 % IACS). This work highlights a synergistic alloy and process design strategy to address key PBF-LB challenges in Cu alloys, enabling their application in high-performance components requiring combined high mechanical strength and electrical conductivity.</div></div>","PeriodicalId":7172,"journal":{"name":"Additive manufacturing","volume":"111 ","pages":"Article 104988"},"PeriodicalIF":11.1000,"publicationDate":"2025-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enabling robust and energy-efficient laser powder bed fusion of Cu alloys via Mo nanoparticle decoration\",\"authors\":\"Guichuan Li , Michel Smet , Yagnitha Kandula , Zhuangzhuang Liu , Brecht Van Hooreweder , Kim Vanmeensel\",\"doi\":\"10.1016/j.addma.2025.104988\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Laser Powder Bed Fusion (PBF-LB) of copper and low-alloyed copper alloys remains challenging due to their low infrared absorptivity and high thermal conductivity. This study introduces a multi-faceted strategy integrating computational thermodynamics-guided alloy design, Mo nanoparticle surface decoration, and thermal process optimization to enable robust and energy-efficient PBF-LB processing of reflective Cu-based alloys. Surface decoration with 0.44 wt% Mo nanoparticles enhances laser energy absorption, enabling a 40–45 % reduction in the required laser volumetric energy density from 167 to 188–100–118 J/mm<sup>3</sup> to achieve > 99.1 % part density. Additionally, Mo addition improves the alloy’s resistance to precipitate coarsening while maintaining low solid solubility in Cu, thereby preserving electrical conductivity. In CuCrZr alloys, baseplate preheating to 300 °C promotes densification and in-situ precipitation of Cr and Cu<sub>x</sub>Zr<sub>y</sub> phases during PBF-LB, enhancing both strength and conductivity. In contrast, Mo addition suppresses in-situ precipitation due to its sluggish diffusion in Cu and preferential partitioning into Cr and Cu<sub>x</sub>Zr<sub>y</sub> phases. After direct age-hardening (450 °C, 9 h), the CuCrZrMo alloy exhibits a fine dispersion of Mo-doped nanoprecipitates, achieving a yield strength of 598 ± 7 MPa (vs. 576 ± 7 MPa for CuCrZr) while retaining high electrical conductivity (67–68 % IACS). This work highlights a synergistic alloy and process design strategy to address key PBF-LB challenges in Cu alloys, enabling their application in high-performance components requiring combined high mechanical strength and electrical conductivity.</div></div>\",\"PeriodicalId\":7172,\"journal\":{\"name\":\"Additive manufacturing\",\"volume\":\"111 \",\"pages\":\"Article 104988\"},\"PeriodicalIF\":11.1000,\"publicationDate\":\"2025-08-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Additive manufacturing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2214860425003525\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214860425003525","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Enabling robust and energy-efficient laser powder bed fusion of Cu alloys via Mo nanoparticle decoration
Laser Powder Bed Fusion (PBF-LB) of copper and low-alloyed copper alloys remains challenging due to their low infrared absorptivity and high thermal conductivity. This study introduces a multi-faceted strategy integrating computational thermodynamics-guided alloy design, Mo nanoparticle surface decoration, and thermal process optimization to enable robust and energy-efficient PBF-LB processing of reflective Cu-based alloys. Surface decoration with 0.44 wt% Mo nanoparticles enhances laser energy absorption, enabling a 40–45 % reduction in the required laser volumetric energy density from 167 to 188–100–118 J/mm3 to achieve > 99.1 % part density. Additionally, Mo addition improves the alloy’s resistance to precipitate coarsening while maintaining low solid solubility in Cu, thereby preserving electrical conductivity. In CuCrZr alloys, baseplate preheating to 300 °C promotes densification and in-situ precipitation of Cr and CuxZry phases during PBF-LB, enhancing both strength and conductivity. In contrast, Mo addition suppresses in-situ precipitation due to its sluggish diffusion in Cu and preferential partitioning into Cr and CuxZry phases. After direct age-hardening (450 °C, 9 h), the CuCrZrMo alloy exhibits a fine dispersion of Mo-doped nanoprecipitates, achieving a yield strength of 598 ± 7 MPa (vs. 576 ± 7 MPa for CuCrZr) while retaining high electrical conductivity (67–68 % IACS). This work highlights a synergistic alloy and process design strategy to address key PBF-LB challenges in Cu alloys, enabling their application in high-performance components requiring combined high mechanical strength and electrical conductivity.
期刊介绍:
Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects.
The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.