金刚石/碳化硅复合材料的热-机械耦合

IF 5.1 3区材料科学 Q2 MATERIALS SCIENCE, COATINGS & FILMS

Diamond and Related Materials Pub Date : 2025-10-07 DOI:10.1016/j.diamond.2025.112936

Haoxuan Wan , Caimin Huang , Yicong Ye , Qiang Chen , Daokui Li

{"title":"金刚石/碳化硅复合材料的热-机械耦合","authors":"Haoxuan Wan , Caimin Huang , Yicong Ye , Qiang Chen , Daokui Li","doi":"10.1016/j.diamond.2025.112936","DOIUrl":null,"url":null,"abstract":"<div><div>A developed constitutive model was established to systematically investigate the interplay of diamond/SiC composites between the thermomechanical deformation and heat transport at multiscale scope. The simulations revealed the significant enhancement of diamond reinforcements on the thermomechanical properties of performance due to its comprehensive intrinsic properties, and that moderate residual Si has limited effect on the composites in addition to reducing interfacial stress by alleviating the thermal expansion mismatch between the SiC matrix and diamond. The thermomechanical coupling in composites is the balance between the strengthening effect of diamond and the negative influence of residual Si. The findings highlight the critical role of interfacial engineering to mitigate these coupled effects for the development of high-power density electronic packaging, ensuring long-term structural integrity and efficient heat dissipation.</div></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":"159 ","pages":"Article 112936"},"PeriodicalIF":5.1000,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The thermomechanical coupling in diamond/SiC composites\",\"authors\":\"Haoxuan Wan , Caimin Huang , Yicong Ye , Qiang Chen , Daokui Li\",\"doi\":\"10.1016/j.diamond.2025.112936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>A developed constitutive model was established to systematically investigate the interplay of diamond/SiC composites between the thermomechanical deformation and heat transport at multiscale scope. The simulations revealed the significant enhancement of diamond reinforcements on the thermomechanical properties of performance due to its comprehensive intrinsic properties, and that moderate residual Si has limited effect on the composites in addition to reducing interfacial stress by alleviating the thermal expansion mismatch between the SiC matrix and diamond. The thermomechanical coupling in composites is the balance between the strengthening effect of diamond and the negative influence of residual Si. The findings highlight the critical role of interfacial engineering to mitigate these coupled effects for the development of high-power density electronic packaging, ensuring long-term structural integrity and efficient heat dissipation.</div></div>\",\"PeriodicalId\":11266,\"journal\":{\"name\":\"Diamond and Related Materials\",\"volume\":\"159 \",\"pages\":\"Article 112936\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2025-10-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Diamond and Related Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0925963525009938\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963525009938","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}

引用次数: 0

摘要

为了在多尺度范围内系统地研究金刚石/碳化硅复合材料的热变形与热输运之间的相互作用，建立了相应的本构模型。模拟结果表明，由于金刚石增强剂具有综合的本征性能，因此对复合材料的热机械性能有显著的提高，并且除了通过减轻SiC基体与金刚石之间的热膨胀失配来降低界面应力外，适量的残余Si对复合材料的影响有限。复合材料的热-机械耦合是金刚石的强化作用和残余硅的负面影响之间的平衡。研究结果强调了界面工程的关键作用，以减轻这些耦合效应，为高功率密度电子封装的发展，确保长期结构完整性和高效散热。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

The thermomechanical coupling in diamond/SiC composites

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The thermomechanical coupling in diamond/SiC composites

A developed constitutive model was established to systematically investigate the interplay of diamond/SiC composites between the thermomechanical deformation and heat transport at multiscale scope. The simulations revealed the significant enhancement of diamond reinforcements on the thermomechanical properties of performance due to its comprehensive intrinsic properties, and that moderate residual Si has limited effect on the composites in addition to reducing interfacial stress by alleviating the thermal expansion mismatch between the SiC matrix and diamond. The thermomechanical coupling in composites is the balance between the strengthening effect of diamond and the negative influence of residual Si. The findings highlight the critical role of interfacial engineering to mitigate these coupled effects for the development of high-power density electronic packaging, ensuring long-term structural integrity and efficient heat dissipation.

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来源期刊

Diamond and Related Materials 工程技术-材料科学：综合

CiteScore

6.00

自引率

14.60%

发文量

702

审稿时长

2.1 months

期刊介绍： DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices. The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.