界面压力演化诱发电缆复合绝缘劣化机理及测量方法综述

IF 7.4 2区 化学 Q1 POLYMER SCIENCE
Shuaibing Li , Pengzhen Wu , Lei Yang , Ping Yan , Yongqiang Kang , Haiying Dong
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引用次数: 0

摘要

在复合绝缘界面处保持足够的界面压力对电缆线路的安全运行至关重要。然而,在实际操作中,在多方面操作条件的影响和电热机械应力的协同作用下,界面压力容易恶化。这种压力的降低促进了界面上气隙和污染颗粒等缺陷的出现。这些缺陷会在电场和热场中引起明显的局部扭曲,通常会引发局部放电,从而导致最终的绝缘失效。复合绝缘界面处杂质颗粒的缺陷产生气隙,导致界面处局部电场和热场畸变,引起局部放电,最终导致绝缘击穿。并且随着电缆系统电压等级的提高,电缆及其附件的工作条件越来越苛刻,由接口压力下降引起的绝缘失效问题更加突出。本文首先从电缆附件设计生产、现场安装运行三个阶段入手,总结出不同阶段界面压力的影响因素,如界面结构、弯曲、内部缺陷、多应力老化、冷热循环等;在此基础上,系统阐述了界面压力退化的机理及其研究现状;其次,对现阶段的界面压力测量方法进行了梳理和总结,并对各种方法的优缺点进行了概述。分析比较了各种方法的优缺点;最后,对界面压力的退化机理及其测量方法的研究进行了系统的展望,旨在为电缆复合绝缘界面状态的评估和附件绝缘的优化设计提供理论指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Degradation mechanism and measurement methods of cable composite insulation induced by interface pressure evolution: A systematic review
Maintaining adequate interfacial pressure at the composite insulation interface is of paramount importance for the secure functioning of cable lines. In practice, however, the interface pressure is prone to deteriorate under the influence of multifaceted operating conditions and the synergistic action of electro-thermal-mechanical stresses. This pressure degradation facilitates the emergence of defects like air gaps and contaminant particles at the interface. These imperfections cause significant local distortions in the electric and thermal fields, typically initiating partial discharge as a precursor to ultimate insulation failure. The defects of impurity particles at the interface of composite insulation produce air gaps, leading to local electric field and thermal field distortion at the interface, which induces partial discharge and eventually leads to insulation breakdown. And as the voltage level of the cable system increases, the cable and its accessories operating conditions become more and more severe, the interface pressure degradation caused by the insulation failure problem is more prominent. The paper firstly starts from the three stages of cable accessory design and production, on-site installation and operation, and summarizes the influencing factors of interfacial pressure at different stages, such as interfacial structure, bending, internal defects, multi-stress aging, and hot and cold cycles, etc.; on this basis, it systematically describes the mechanism of interfacial pressure degradation and its current research status; secondly, it combs and summarizes the interfacial pressure measurement methods at present stage, and gives an overview of the advantages and disadvantages of the various methods. The advantages and disadvantages of various methods are analyzed and compared; finally, a systematic outlook is given to the research on the degradation mechanism of interfacial pressure and its measurement methods, aiming to provide theoretical guidance for the assessment of the state of the interface of composite insulation of cables and the optimization of the design of accessory insulation.
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来源期刊
Polymer Degradation and Stability
Polymer Degradation and Stability 化学-高分子科学
CiteScore
10.10
自引率
10.20%
发文量
325
审稿时长
23 days
期刊介绍: Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology. Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal. However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.
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