直接墨水书写PEDOT:基于pss的接口,具有高拉伸性和强附着力,适用于柔性电子产品

IF 3.9 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Guiqun Liu, Pengwei Jiao, Qisheng Ma, Ding Li, Wenli Wu, Min Xue, Xiaoli Zhang
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引用次数: 0

摘要

导电聚合物基生物胶导电界面(CP-BCI)因其易于加工制造、具有良好的电学和生物相容性而广泛应用于生物电子学、应变传感器等领域。然而,CP-BCI通常是使用铸造成型、丝网印刷、电化学图案和光刻等技术制造的。这些传统方法在实现精确控制和生成复杂图案方面经常遇到挑战,从而限制了这些材料的广泛应用和发展。直墨书写由于具有较高的可编程性、精度和工艺稳定性,已成为CP-BCI加工的新兴研究热点。在此,具有增强导电性和高附着力的生物界面油墨已被专门开发用于直接油墨印刷。这种新型油墨的开发涉及将PAM纳入PVA基体以促进复合交联,再加上PEDOT:PSS导电纳米纤维在基体内的集成,从而产生PEDOT:PSS-PAM-PVA生物界面油墨。该创新油墨具有卓越的印刷性能、高导电性(0.24±0.053 S m−1)、高附着力(54±2.7 kPa)和良好的平衡机械结构,最大应力为51 kPa,断裂伸长率为369%。本研究介绍了一种新型直写墨水,促进了柔性电子制造的进步。图形抽象
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Direct ink writing PEDOT:PSS-based interfaces with high stretchability and strong adhesion for flexible electronics

Conducting polymer-based bioadhesive conductive interface (CP-BCI) are widely used in bioelectronics, strain sensors due to their ease of processing and fabrication, excellent electrical, and biocompatibility. However, CP-BCI is conventionally fabricated using techniques such as cast molding, screen printing, electrochemical patterning, and photolithography. These traditional methodologies often encounter challenges in achieving precise control and the generation of intricate patterns, thus limiting the widespread application and evolution of these materials. Direct ink writing has become an emerging research hotspot for processing CP-BCI due to its high degree of programmability, precision, and process stability. Herein, biointerface inks with enhanced electrical conductivity and high adhesion have been specifically developed for direct ink printing. The development of this novel ink involves the incorporation of PAM into the PVA matrix to promote composite cross-linking, coupled with the integration of PEDOT:PSS conductive nanofibers within the matrix, thereby yielding the PEDOT:PSS-PAM-PVA biointerface ink. The innovative ink showcases exceptional printability, high electrical conductivity (0.24 ± 0.053 S m−1), high adhesion (54 ± 2.7 kPa), and a well-balanced mechanical profile, featuring a maximum stress of 51 kPa and an elongation at break of 369%. This research introduces the novel direct writing ink, promoting advancements in the manufacturing of flexible electronics.

Graphical abstract

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来源期刊
Journal of Materials Science
Journal of Materials Science 工程技术-材料科学:综合
CiteScore
7.90
自引率
4.40%
发文量
1297
审稿时长
2.4 months
期刊介绍: The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.
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