低能氢轰击下锐钛矿型TiO2间隙态的可控还原与发展

IF 6.9 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Iva Šarić Janković, Robert Peter, Ivna Kavre Piltaver, Harun Hano, Karlo Veličan, Antonio Borzatti, Mato Knez, Mladen Petravić
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引用次数: 0

摘要

在本研究中,我们研究了在室温下低能H2+离子轰击诱导锐钛矿型TiO2薄膜的还原机制和电子结构的修饰,重点研究了氢诱导的Ti原子氧化态的变化、氧的局部化学键和带隙内缺陷态的形成。在轰击的初始阶段,高能氢与晶格氧反应形成羟基,随后Ti4+还原为Ti3+。在较高剂量下,H − O − H桥键的形成导致O − Ti键的分裂和H2O气体分子的形成,同时Ti3+和Ti4+态还原为Ti2+。同时,Ti4+还原到较低的氧化态,在TiO2的带隙中引入了一些缺陷态,这些缺陷与Ti3+缺陷或在Ti2+位点形成双氧空位簇有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Controlled reduction and development of in-gap states in anatase TiO2 under low-energy hydrogen bombardment

Controlled reduction and development of in-gap states in anatase TiO2 under low-energy hydrogen bombardment
In this study, we investigate the reduction mechanism and modifications of the electronic structure of anatase TiO2 thin films induced by low-energy H2+ ion bombardment at room temperature, focusing on hydrogen-induced changes in the oxidation states of Ti atoms, local chemical bonding of oxygen and the formation of defect states within the band gap. During the initial stages of bombardment, the energetic hydrogen reacts with lattice oxygen to form hydroxyl groups, followed by the reduction of Ti4+ to Ti3+. For the higher doses, the formation of H − O − H bridge bonds causes splitting of O − Ti bonds and formation of H2O gas molecules, accompanied by a reduction of Ti3+ and Ti4+ states to Ti2+. At the same time, the reduction of Ti4+ to lower oxidation states introduces some defect states within the band gap of TiO2, associated with Ti3+ defects or the formation of double-oxygen-vacancy clusters at Ti2+ sites.
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来源期刊
Applied Surface Science
Applied Surface Science 工程技术-材料科学:膜
CiteScore
12.50
自引率
7.50%
发文量
3393
审稿时长
67 days
期刊介绍: Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.
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